Electronic Breaking News Archive - Page 429 of 450

Spring-Loaded Edge Connectors: Enhancing Connectivity with Precision

Kyocera, a leading manufacturer of electronic components, has recently unveiled its latest innovation in the form of the 9159-7X0 Series. This series of double-ended linear card-edge connectors features a unique beryllium copper spring contact system, setting it apart from other connectors in...

Published on: December 13, 2023

New Photovoltaic Output Photocoupler Enhances High-Voltage Power MOSFET Gating

Toshiba has announced that it is now in volume production of a photovoltaic output photocoupler with an enhanced open-circuit voltage suitable for gating high-voltage power MOSFETs commonly used in solid-state relays (SSRs).The TLX9910 photocoupler is primarily designed for use within SSR applications...

Published on: December 13, 2023

Imec’s GaN-on-Si MISHEMTs: Cost-effective and High-performing Alternative to GaN MISHEMTs

Imec has developed aluminum-nitride/gallium-nitride (AlN/GaN) metal-insulator-semiconductor high-electron mobility transistors (MISHEMTs) on 200mm Si with high output power and energy efficiency while operating at 28GHz.With these results, imec's GaN-on-Si MISHEMT technology outperforms other GaN MISHEMT device technology in terms of performance, while the...

Published on: December 13, 2023

AccelerCom Partners with AMD to Drive O-RAN Adoption

AccelerComm, the Southampton Layer 1 5G IP specialists, announced today that AMD has licensed its 3GPP LDPC accelerator IP for use on its T2 Telco Accelerator Card.The AMD T2 Telco Accelerator Card offers a high-performance, low-latency, and power-efficient platform for 5G O-DU...

Published on: December 12, 2023

UK Space Sector Projects Receive Funding from Enabling Technologies Programme

The UK government has announced funding for a range of projects aimed at boosting the development of new space technologies in the country. The Enabling Technologies Programme (ETP) will provide £4 million in total, with £3.2 million coming from the UK Space...

Published on: December 12, 2023

BAE Secures $35 Million in US Chips Act Funding

BAE Systems, a leading defense contractor, has been awarded $35 million in funding from the US Chips Act to modernize its Microelectronics Centre in Nashua, New Hampshire. The facility, which specializes in mature-node production, will use the funds to replace aging tools...