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Optical I/O Packaging Boosts FPGA Performance

Optical I/O Packaging Boosts FPGA Performance

n Ayar Labs, a leading technology company, has made a significant breakthrough in high-performance computing by integrating an Intel Agilex FPGA into an optical I/O chiplet package. This integration has resulted in a remarkable achievement, with Ayar Labs claiming that their solution...

Published on: November 09, 2023

Quantum Motion Partners with University of Pennsylvania

Quantum Motion Partners with University of Pennsylvania

n Quantum Motion, a UK-based quantum computing scale-up founded by Professor John Morton, University College London (UCL), and Professor Simon Benjamin, University of Oxford, has signed a partnership with the University of Pennsylvania. Quantum Motion will provide researchers with access to its...

Published on: November 09, 2023

New 1.25ns Gate Driver Boosts GaN HEMTs Performance

New 1.25ns Gate Driver Boosts GaN HEMTs Performance

n Rohm Introduces Nanosecond Gate Driver for GaN Power Transistors Rohm, a leading semiconductor manufacturer, has unveiled a new nanosecond gate driver designed specifically for GaN power transistors. This innovative driver is targeted towards applications such as lidar, dc-dc converters, and Class-D...

Published on: November 08, 2023

Introducing Alif Semi: Cutting-Edge 32bit AI MCUs Revolutionizing Battery-Powered Devices

Introducing Alif Semi: Cutting-Edge 32bit AI MCUs Revolutionizing Battery-Powered Devices

n Alif Semiconductor's 32bit 'Ensemble' AI-enabled MCUs are now available, according to the company. Built around various Arm cores with added security to protect stored intellectual property, they are intended to run AI algorithms locally in battery-powered devices. "There are many Edge...

Published on: November 08, 2023

US Investors Dominate 2023 UK Venture Deals, Outpacing Global Competition

US Investors Dominate 2023 UK Venture Deals, Outpacing Global Competition

UK Leads in Venture Deals with US Investors In 2023, the United Kingdom emerged as the top destination for venture deals involving US investors, surpassing all other countries, according to a report by Pitch Book. During the year, US investors actively participated...

Published on: November 08, 2023

Telecom and Pay TV Revenues Soar, but RAN Revenues Remain Stagnant for a Decade

Telecom and Pay TV Revenues Soar, but RAN Revenues Remain Stagnant for a Decade

n Worldwide spending on telecommunication and pay TV services is expected to reach $1.55 trillion in 2023, representing a 3.0% increase from 2022, according to a report by IDC. The primary driver behind this growth is inflation. However, the report also highlights...

Published on: November 08, 2023

Q3 Wafer Shipments Experience 9.6% Decline Quarter-on-Quarter

Q3 Wafer Shipments Experience 9.6% Decline Quarter-on-Quarter

Q3 wafer shipments for semiconductor applications experienced a significant decline of 9.6% quarter-on-quarter, dropping to 3,010 million square inches. This represents a 19.5% decrease compared to the 3,741 million square inches recorded in Q3 2022, according to SEMI, the global industry association...

Published on: November 08, 2023

UK Government Bolsters Rocket Factory Augsburg’s Shetland Islands Expansion

UK Government Bolsters Rocket Factory Augsburg’s Shetland Islands Expansion

Rocket Factory Augsburg Receives £3.5 Million Funding Boost for Satellite Launches Rocket Factory Augsburg (RFA) has secured a £3.5 million funding boost from the UK Space Agency to support its plans for vertically launching satellites from the SaxaVord spaceport in the Shetland...

Published on: November 08, 2023

EV Battery Market Set to Surge with 16.9% Growth by 2028

EV Battery Market Set to Surge with 16.9% Growth by 2028

n The market for Li-ion battery packs for BEV and PHEV is projected to reach approximately $180 billion in 2028, with a compound annual growth rate (CAGR) of 16.9% from 2022 to 2028, according to a report by Yole Developpement. The battery...

Published on: November 08, 2023

Introducing the Chip-Scale Package: A Wireless MCU for Bluetooth 5.3 LE

Introducing the Chip-Scale Package: A Wireless MCU for Bluetooth 5.3 LE

ST has recently unveiled a new wireless microcontroller featuring Bluetooth 5.3 LE software. The microcontroller, known as STM32WB09, comes in a compact 5 x 5mm QFN package and is expected to be available in an even smaller ~2.8 x 3mm chip-scale package....

Published on: November 07, 2023

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