Teradyne and Infineon Technologies AG have announced that they have entered into a strategic agreement to advance power semiconductor test.As part of the agreement, Teradyne will acquire part of Infineon’s automated test equipment team in Regensburg, Germany. For its part, Infineon will...
Published on: February 03, 2025
Former chipmarket leader Intel exceeded some analysts’ expectations with the publication of its 4Q24 financial results. There are indications that the company may be approaching the bottom after a spectacular fall in its prospects during 2024.However, the Intel Foundry subsidiary operation, which...
Published on: February 03, 2025
Researchers at the Fraunhofer Institute for Factory Operation and Automation IFF are developing technology for automated, nondestructive robotic disassembly of electronics for remanufacturing and material recycling. The project, named iDEAR (Intelligent Disassembly of Electronics for Remanufacturing and Recycling), will help establish an...
Published on: February 03, 2025
binder in Germany has expanded its series of M12-X-coded connectors to meet the requirements of rail and transport applications as well as agriculture.The M12-X-coded connectors are aimed at Cat6a Ethernet communication infrastructures that can handle strong vibrations and shocks for camera-based monitoring...
Published on: February 03, 2025
European researchers have used quantum light to improve the performance of cutting-edge terahertz spectroscopy.The technique, using two entangled photons, enables measurements of infrared electric fields which are twice as sensitive as previous time-domain spectroscopy measurement systems.Time-domain spectroscopy uses ultra-short pulses of laser...
Published on: February 03, 2025
European chip company STMicroelectronics revealed sales revenue exactly on guidance at $3.32 billion for 4Q24 but said sales will drop by about 27 percent sequentially to about US$2.5 billion in 1Q25.A quarter before the company had said that 2025 would start weakly...
Published on: February 03, 2025
EnSilica has announced it has been awarded funding of £10.38 million over the next three-years from the UK Space Agency under its Connectivity in Low-Earth Orbit or “C-LEO” programme to initiate a new project for the development of the next-generation of satellite...
Published on: February 03, 2025
Extoll in Germany is to supply its serialiser/deserialiser (SerDes) IP to BeammWave as part of a next generation telecoms chip.BeammWave in Sweden is a specialist in mmWave 5G/6G digital beamforming and is developing the chip on the GlobalFoundries (GF) 22nm low power...
Published on: February 03, 2025
UK startup MintNeuro has received three funding awards from the Advanced Research and Invention Agency (ARIA) for its low power semiconductor technology for minimally-invasive neural implant designs.The £17m funding for MintNeuro and its partners as part of the UK R&D funding agency’s...
Published on: February 03, 2025
By applying techniques from explainable artificial intelligence, engineers can improve users’ confidence in forecasts generated by artificial intelligence modelsResearchers at EPFL’s Wind Engineering and Renewable Energy Laboratory (WiRE) have tailored explainable AI (XAI) to the black-box AI models used in their field....
Published on: February 02, 2025