Electronic Breaking News

European lessons from DeepSeek AI

European lessons from DeepSeek AI

The emergence of Chinese AI company DeepSeek has some key lessons for the European industry says a UK entrepreneur.DeepSeek, based in Hangzhou in south-east China, has developed two AI frameworks that can run large language models (LLMs) that can challenge the performance...

Published on: January 27, 2025

FBDi chair Georg Steinberger dies suddenly

FBDi chair Georg Steinberger dies suddenly

German distribution association FBDi has announced that its chair, Georg Steinberger, died suddenly from a cardiac arrest on Friday at the age of 63.“A sad moment for FBDi and the electronics industry. Georg Steinberger leaves a deep void as an expert in...

Published on: January 27, 2025

Plug-n-Play Spectral Imaging on Mobile Platforms

Plug-n-Play Spectral Imaging on Mobile Platforms

Spectricity, a provider of multispectral imaging solutions for mobile devices, announced the launch of its S1-A Accessory DeviceThe S1-A Accessory Device, equipped with a 15-channel multispectral imaging sensor, brings the power of spectral imaging to mobile platforms. This enables the development of...

Published on: January 27, 2025

IQE, Quintessent prepare quantum dot wafers for AI

IQE, Quintessent prepare quantum dot wafers for AI

Laser and photonics company Quintessent Inc. (Goleta, Calif.) and wafer supplier IQE plc (Cardiff, Wales) are elevating an R&D partnership on photonics for datacenters to the commercial level.Quintessent, founded in 2019, has ordered US$500,000 of epitaxial wafers from IQE plc for quantum...

Published on: January 27, 2025

KULR teams for datacentre cooling

KULR teams for datacentre cooling

US power material developer Kulr has signed a strategic partnership with a long-standing Nvidia integration partner for its technology in datacentre technology shipping from Taiwan.EDOM Technology will use the Kulr Xero Vibe (KXV) and Kulr ONE product lines to address the need for...

Published on: January 27, 2025

More Intel military customers for 18A process

More Intel military customers for 18A process

Amid all the talk of a break-up of Intel, the company has announced two defense companies that will be using its 18A process technology through Intel Foundry.Trusted Semiconductor Solutions and Reliable MicroSystems are part of the third phase of the Rapid Assured...

Published on: January 27, 2025

3D printing bio-inspired structures for wearables and robotics

3D printing bio-inspired structures for wearables and robotics

Since its introduction in 1985, 3D printing has become cheaper than traditional manufacturing technologies, but more importantly offers the ability to customise designs and make prototypes on demand. Over the past decade, there has been an accelerating demand for 3D printing methods...

Published on: January 27, 2025

Efficient COM-HPC Size E Extension boosts performance

Efficient COM-HPC Size E Extension boosts performance

Advantech has announced the SOM-E781, a COM-HPC Size E Extension featuring the AMD EPYC™ Embedded 8004 series processor.Designed for high-performance Edge Server applications, the COM-HPC Size E Extension delivers server-grade performance with an optimized pin-out that supports up to 572-W of board-to-board...

Published on: January 27, 2025

Indian fabless chip startup floats US$10 billion fab plan

Indian fabless chip startup floats US$10 billion fab plan

The CEO of fabless chip company L&T Semiconductor Technologies Ltd. (Bengaluru, India) has said he has a plan to build a US$10 billion wafer fab using subsidies.Founded in 2023 LTSCT is a wholly-owned subsidiary of Larsen & Toubro Ltd. (Mumbai, India), an...

Published on: January 27, 2025

Infineon moves to 28nm for smallest eSIM

Infineon moves to 28nm for smallest eSIM

Infineon Technologies has launched the smallest eSIM compliant with the GSMA standards for wearables, smartphones, tablets and devices in the Internet of Things (IoT).The Optiga Connect Consumer OC1230 measures 1.8 x 1.6 x 0.4 mm in chip scale packaging with 1Mbyte of...

Published on: January 27, 2025