Find ASIC Vendors

Electronic Breaking News

First 1250V MLCC with 10 nF in 3225 format

First 1250V MLCC with 10 nF in 3225 format

TDK has launched the industry’s highest capacity multilayer ceramic capacitors (MLCCs) at 1250V in a 3225 form factor.The 10nF CGA and C MLCC series measures 3.2 x 2.5 x 2.5 mm with C0G characteristics with a Class I dielectric.C0G characteristic products change...

Published on: January 22, 2025

End-to-end 5G Open RAN starter kit simplifies testing

End-to-end 5G Open RAN starter kit simplifies testing

A British wireless semiconductor innovator specialising in 5G Open RAN baseband technologies, RANsemi has launched its 5G Open RAN Starter Kit designed to enable out-of-the-box testing and accelerate the development of 5G radio access networks (RANs).The starter kit suits companies looking to...

Published on: January 22, 2025

Arm Cortex-M4 based MCUs target motor control applications

Arm Cortex-M4 based MCUs target motor control applications

Toshiba Electronics Europe GmbH has introduced seven new 32-bit microcontrollers (MCUs) with Arm® Cortex®-M4 cores, expanding its motor control lineup.The new MCUs are ideally suited for field-oriented control (FOC) of up to two AC motors, brushless DC (BLDC) motors and multiple types...

Published on: January 22, 2025

IAR supports TMC Arm Cortex-R52+ ASIL D MCUs

IAR supports TMC Arm Cortex-R52+ ASIL D MCUs

IAR has announced that IAR Embedded Workbench for Arm v9.60.3 supports the THA6 Gen2 series automotive-grade MCUs from Tongxin Microelectronics Co., Ltd., or TMC.The TMC THA6 Gen2 series is the first Arm Cortex-R52+ ASIL D MCU in China. Operating at a frequency...

Published on: January 22, 2025

Altium buys Part Analytics for AI supply chain capabilities

Altium buys Part Analytics for AI supply chain capabilities

Altium has completed the acquisition of Milwaukee-based Part Analytics for its leading AI-powered supply chain management platform, which enables manufacturers to quickly make fully informed decisions for large-scale component planning and procurement, particularly at the enterprise level.The acquisition will enable the introduction...

Published on: January 22, 2025

Tachyum adds post-quantum algorithms to universal processor

Tachyum adds post-quantum algorithms to universal processor

European universal chip designer Tachyum has added all four post-quantum cryptography (PQC) algorithms to the software distributions for its Prodigy processor.Adding the quantum-safe PQC algorithms, approved by the US National Institute of Standards and Technology as a global standard last August, ensures...

Published on: January 22, 2025

Quantinuum to build photonic quantum R&D centre in New Mexico

Quantinuum to build photonic quantum R&D centre in New Mexico

UK/US quantum company Quantinuum is to build a cutting-edge research and development hub in New Mexico for photonic technology.Quantinuum was formed from the merger of Cambridge Quantum Computing in the UK and Honeywell’s quantum business and is the largest dedicated quantum technology...

Published on: January 22, 2025

Tachyum adds post-quantum algorithms to universal procesor

Tachyum adds post-quantum algorithms to universal procesor

European universal chip designer Tachyum has added all four post-quantum cryptography (PQC) algorithms to the software distributions for its Prodigy processor.Adding the quantum-safe PQC algorithms, approved by the US National Institute of Standards and Technology as a global standard last August, ensures...

Published on: January 22, 2025

Keysight adds UCIe, BoW standards to Chiplet PHY Designer 2025

Keysight adds UCIe, BoW standards to Chiplet PHY Designer 2025

Keysight Technologies has added support for both interconnect standards to the latest version of its Chiplet PHY Designer 2025 design tool.The enhanced software introduces simulation capabilities for the Universal Chiplet Interconnect Expressä (UCIe) 2.0 standard and the Open Computer Project Bunch of Wires (BoW) standard.Chiplet PHY Designer enables...

Published on: January 22, 2025

TDK backs graphene thermal interface startup for data centre cooling

TDK backs graphene thermal interface startup for data centre cooling

TDK is backing stealth start-up NovoLinc for its high-performance thermal interface material for data centre chips.TDK ventures is investing in NovoLinc in Pittsburgh, Pennsylvania, that has used proprietary materials system and nanomechanical design to lower thermal resistance. The technology, originally developed at Carnegie Mellon...

Published on: January 22, 2025

...

5
10
15

...

92
93
94

...

100
105
110

...