Electronic Breaking News

ST looks to cut up to 6% of staff, says report

ST looks to cut up to 6% of staff, says report

Struggling European chipmaker STMicroelectronics NV is looking to cut between 2,000 and 3,000 staff to address a slump in the industrial and automotive chip markets it serves, according to Bloomberg.The staff cuts are set to implemented by way of an early retirement...

Published on: February 03, 2025

Foundry unit haunts tepid Intel fourth quarter results

Foundry unit haunts tepid Intel fourth quarter results

Former chipmarket leader Intel exceeded some analysts’ expectations with the publication of its 4Q24 financial results. There are indications that the company may be approaching the bottom after a spectacular fall in its prospects during 2024.However, the Intel Foundry subsidiary operation, which...

Published on: February 03, 2025

Teradyne and Infineon team up on ATE power test

Teradyne and Infineon team up on ATE power test

Teradyne and Infineon Technologies AG have announced that they have entered into a strategic agreement to advance power semiconductor test.As part of the agreement, Teradyne will acquire part of Infineon’s automated test equipment team in Regensburg, Germany. For its part, Infineon will...

Published on: February 03, 2025

Intel Foundry haunts tepid fourth quarter results

Intel Foundry haunts tepid fourth quarter results

Former chipmarket leader Intel exceeded some analysts’ expectations with the publication of its 4Q24 financial results. There are indications that the company may be approaching the bottom after a spectacular fall in its prospects during 2024.However, the Intel Foundry subsidiary operation, which...

Published on: February 03, 2025

Fraunhofer looks to automation for electronics disassembly

Fraunhofer looks to automation for electronics disassembly

Researchers at the Fraunhofer Institute for Factory Operation and Automation IFF are developing technology for automated, nondestructive robotic disassembly of electronics for remanufacturing and material recycling. The project, named iDEAR (Intelligent Disassembly of Electronics for Remanufacturing and Recycling), will help establish an...

Published on: February 03, 2025

Robust M-12 connectors for rail and transport

Robust M-12 connectors for rail and transport

binder in Germany has expanded its series of M12-X-coded connectors to meet the requirements of rail and transport applications as well as agriculture.The M12-X-coded connectors are aimed at Cat6a Ethernet communication infrastructures that can handle strong vibrations and shocks for camera-based monitoring...

Published on: February 03, 2025

Quantum light boost for THz spectroscopy

Quantum light boost for THz spectroscopy

European researchers have used quantum light to improve the performance of cutting-edge terahertz spectroscopy.The technique, using two entangled photons, enables measurements of infrared electric fields which are twice as sensitive as previous time-domain spectroscopy measurement systems.Time-domain spectroscopy uses ultra-short pulses of laser...

Published on: February 03, 2025

ST forecasts a big first quarter revenue drop

ST forecasts a big first quarter revenue drop

European chip company STMicroelectronics revealed sales revenue exactly on guidance at $3.32 billion for 4Q24 but said sales will drop by about 27 percent sequentially to about US$2.5 billion in 1Q25.A quarter before the company had said that 2025 would start weakly...

Published on: February 03, 2025

Ensilica in UK Space Agency award for satellite broadband ICs

Ensilica in UK Space Agency award for satellite broadband ICs

EnSilica has announced it has been awarded funding of £10.38 million over the next three-years from the UK Space Agency under its Connectivity in Low-Earth Orbit or “C-LEO” programme to initiate a new project for the development of the next-generation of satellite...

Published on: February 03, 2025

SerDes IP for low power telecoms chip

SerDes IP for low power telecoms chip

Extoll in Germany is to supply its serialiser/deserialiser (SerDes) IP to BeammWave as part of a next generation telecoms chip.BeammWave in Sweden is a specialist in mmWave 5G/6G digital beamforming and is developing the chip on the GlobalFoundries (GF) 22nm low power...

Published on: February 03, 2025