Rapidus Broadens IBM Partnership to Include Chiplet Packaging

Rapidus, a leading semiconductor company, has recently announced an expansion of its partnership with IBM to include chiplet packaging for the 2nm devices it plans to manufacture in Japan. This collaboration marks a significant step forward in the development of cutting-edge semiconductor technology.

The partnership between Rapidus and IBM involves the construction of the first integrated fab and packaging plant, which will utilize IBM's 2nm process technology. By 2027, Rapidus aims to establish mass production capabilities for chiplet packages using IBM's advanced packaging technology. This initiative is part of a larger effort to enhance Japan's position in the global semiconductor industry.

As part of a Japanese government project focused on advancing chiplet packaging technology, Rapidus and IBM are working together to drive innovation and accelerate the development of next-generation semiconductor solutions. This collaboration underscores the importance of international partnerships in driving technological progress and fostering industry growth.

IBM, known for its expertise in R&D and manufacturing technologies for semiconductor packaging, brings a wealth of experience to the partnership. With a strong track record of successful joint development projects with Japanese semiconductor manufacturers, IBM is well-positioned to support Rapidus in achieving its goals for chiplet packaging technology.

In addition to its collaboration with IBM, Rapidus has also secured a deal for packaging technology with Fraunhofer in Germany. These strategic partnerships highlight Rapidus' commitment to leveraging global expertise and resources to drive innovation and establish itself as a key player in the semiconductor industry.