ROHM introduces SiC module for high design flexibility

ROHM has unveiled the DOT-247, a cutting-edge 2-in-1 silicon carbide (SiC) molded module engineered to enhance design flexibility and power density in industrial power applications like PV inverters, UPS systems, and semiconductor relays. By maintaining the familiar TO-247 footprint while doubling chip capacity, this innovative module aims to streamline system integration and reduce the size of power conversion designs.

For readers of eeNews Europe, this launch underscores how packaging advancements in SiC technology can boost power density while simplifying system complexity—crucial considerations for designers focusing on next-generation energy and industrial platforms.

Enhanced Design with Increased Density

The DOT-247 (SCZ40xxDTx, SCZ40xxKTx) merges two TO-247 packages into a single molded module, enabling the incorporation of larger chips that were previously challenging to accommodate. Through an optimized internal structure, the module achieves approximately 15% lower thermal resistance and 50% lower inductance compared to a standard TO-247 package. In a half-bridge configuration, this results in 2.3 times higher power density—delivering equivalent output in roughly half the volume.

ROHM offers the DOT-247 in two configurations, half-bridge, and common-source, to cater to the mixed setups observed in multi-level circuits. While current PV inverters mainly utilize two-level designs, there is a growing demand for higher-voltage three- and five-level circuits like NPC, T-NPC, and ANPC. By standardizing half-bridge and common-source topologies in a 2-in-1 module, ROHM minimizes the requirement for custom components and facilitates the adoption of advanced architectures such as DC-DC converters and NPC circuits.

Comprehensive Support and Availability

Evaluation boards will be gradually introduced, accompanied by a comprehensive support package encompassing in-house motor testing, simulations, and thermal design data. A double-pulse testing evaluation kit is already available, with a 3-phase inverter kit and reference designs anticipated in November 2025. SPICE models are currently accessible, while LTspice models for three-level NPC circuits will be released in October 2025.

Mass production of the DOT-247 is scheduled to commence in September 2025. Samples of automotive-grade versions compliant with AEC-Q101 will be shipped in October 2025.

“ROHM is dedicated to providing application-level support, including the utilization of in-house motor testing equipment,” the company affirmed.

With the introduction of the DOT-247, ROHM is strategically positioning its SiC module portfolio to meet the escalating demand for compact, high-density solutions in renewable energy and industrial power systems.