Soitec and UMC Collaborate on Groundbreaking 3D RF-SOI Chips

French substrate developer Soitec has joined forces with UMC to pioneer the industry's groundbreaking 3D IC solution tailored for Radio Frequency Silicon-on-Insulator (RF-SOI) technology, specifically designed for 5G and millimeter wave applications.

UMC's innovative 3D IC technology for RF-SOI leverages Soitec's engineered wafers to enable the integration of a higher number of RF front-end modules within a single device. This is achieved through the vertical stacking of dies with wafer-to-wafer bonding, a cutting-edge approach that promises to revolutionize the landscape of RF design.

By adopting this 3D RF-SOI methodology, designers can significantly reduce die size by over 45%, empowering them to seamlessly incorporate more RF components to cater to the escalating bandwidth demands of 5G networks. This includes accommodating new spectrum allocations for millimeter wave bands, a crucial aspect in the evolution of wireless communication technologies.

The RF-SOI substrates provided by Soitec offer the necessary mechanical and electrical performance attributes essential for ensuring the seamless large-scale manufacturing of UMC's solution. Importantly, this integration does not compromise the RF performance, underscoring the robustness and reliability of the collaborative effort between the two companies.

"We are thrilled about our enduring partnership with UMC, which has now culminated in the industry's first 3D IC for RF-SOI. The collective experience and expertise of UMC and Soitec position us strongly to drive innovation and tackle the forthcoming challenges in energy- and volume-efficient RF Front Ends," remarked Jean-Marc Le Meil, Executive Vice President of the Mobile Communications Division at Soitec.

"Soitec has been a pivotal collaborator for UMC in propelling advancements in wireless communications, thanks to their state-of-the-art engineered substrates. Building on this robust partnership, UMC's pioneering 3D IC solution for RF-SOI has garnered significant interest from customers seeking to seamlessly integrate more RF components in 5G-enabled wireless devices without compromising on form factor or performance," noted Raj Verma, Associate Vice President of Technology Development at UMC.