Thermal simulation rack for two phase liquid cooling

Accelsius, a US-based cooling IP spin out of Nokia Bell Labs, has developed a Thermal Simulation Rack (TSR) system for data centres.

The simulation rack has integrated Load Simulation Sleds (LSS) with a modular design supporting up to 50kW of simulated thermal load per rack. The Load Simulation Sleds replicate the heat output of the latest high-performance CPUs and GPUs and a software interface allows control of individual LSSs and system monitoring.

Accelsius is commercialising the patented two-phase, direct-to-chip liquid cooling systems with a sustainable, safe dielectric fluid for data centre and edge applications it calls NeuCool.

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The TSR is available in two standard configurations: TSR-30 (up to 30kW) and TSR-50 (up to 50kW) but can be customized in-row for up to 250kW of total power. This flexibility allows users to create realistic test environments that closely mirror their production data centre conditions to be compatible with various facility cooling infrastructures

“As an industry, we’re seeing a paradigm shift in data center thermal management for increasingly powerful chips and servers,” said Dr. Rich Bonner, CTO/CPO of Accelsius. “Our Thermal Simulation Rack allows customers and partners a more data-driven approach to confidently evaluate and adopt advanced liquid cooling solutions, like our NeuCool system, ensuring they can meet the demands of next-generation computing while optimizing energy efficiency and sustainability.”