Tria to Launch Five Families of Embedded Modules at Embedded World

At its debut at Embedded World, Tria Technologies, an Avnet company, is introducing five new product families of embedded modules powered by Qualcomm Dragonwing™ and Snapdragon® platforms. Tria, a leading module vendor with the largest SMARC® portfolio in the market, is expanding its technology portfolio with these new embedded modules.

“We are very excited about our relationship with Qualcomm Technologies and showcasing our new modules, which are applicable to a wide range of low- to high-end applications,” said Daniel Denzler, Senior Director, Business Line Management for Boards and Systems, Tria Technologies. “This new module family based on Dragonwing platforms enables us to address virtually any requirement, conserving power, upgrading performance and delivering AI capabilities for use in challenging environments across a range of module standards.”

“Dragonwing processors are designed to provide high-performance, low-power edge computing and on-device AI, enabling industries to achieve new heights of innovation and efficiency,” said Douglas Benitez, Senior Director, Business Development for Qualcomm Europe, Inc.

The embedded modules offer powerful computing capabilities and power efficiency, making them ideal for the new generation of IoT devices. The enhanced AI performance opens new markets for AI deployment at the edge.

One of several advantages of Tria’s new modules is that they are designed and manufactured in Germany.

Further reading

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