UK to Open £1.6m Power Device Packaging Facility

A new £1.6m packaging facility dedicated to power devices has been officially inaugurated at the Compound Semiconductor Applications (CSA) Catapult in Newport, South Wales. This state-of-the-art power packaging facility is the first of its kind in the UK, offering an open access setting that aims to enhance the performance of both silicon and compound semiconductor technologies.

The facility, known as DER-IC South West and Wales, serves as a prototype facility for manufacturers looking to develop semiconductor and compound semiconductor advanced packages using innovative 3D printing techniques. This marks a significant milestone as it is the first facility in the UK to provide open access to such cutting-edge technology.

Part of the Driving the Electric Revolution Industrialisation Centre (DER-IC) South West and Wales, this new facility joins a network of four centers across the UK that provide open access equipment, facilities, and expertise to the power electronics, machines, and drives (PEMD) manufacturing supply chain. However, it stands out as the first open access facility of its kind.

The 3D printing equipment available at the facility enables the integration of various technologies for chip packages, heat sinks, and printed circuit board (PCB) designs. This includes a multi-material 3D printer for prototyping novel packages using ceramic and mixed materials, as well as a 3D metal printer for creating fast prototypes using conductive materials like copper.

Moreover, an optimized laser system is in place to dice semiconductors and process ceramic or metal materials for innovative package designs. Paul Jarvie, the DER-IC South West and Wales center lead, emphasized the significant opportunities this facility offers to the PEMD manufacturing supply chain, inviting industry players interested in innovation, technology development, and manufacturing scale-up to engage with the center.