UV enhanced die bonder speeds PCB assembly

Electronics Manufacturing Services (EMS) provider Escatec has integrated a UV curing light with a die bonder to boost the precision and efficiency of micro-assembly and printed circuit board (PCB) processes.

The team at Escatec Switzerland built a customized UV-curing system with two 365nm light sources on the die bond head of a Tresky T6000 fully automatic machine. This enables the company to achieve exact positioning of components and direct snap-curing required during the passive alignment process. The enhancement accelerates and improves the process of adhesive curing during the pick-and-place operations, streamlining the manufacturing process overall and boosting the accuracy of component placement, which is critical for the assembly of complex electronic parts.

The Swiss site is one of several for the Malaysia-based company, with a focus on process development. It has sites in the UK and Czech Republic following the acquisition of JJS Manufacturing and a new site in Bulgaria.

Micro-assembly processes traditionally face challenges such as achieving high precision and managing adhesive curing times effectively. The UV light feature directly addresses these issues by significantly reducing the time required for the adhesive to set, which in turn, speeds up the entire assembly process.

The precise control over UV exposure ensures accurate placement and bonding of components, crucial to produce high-quality electronic devices. The improved bonding techniques increase the durability and reliability of the finished products, meeting the high standards required in the electronics industry, and can be used for components that need to vibrate, such as piezoelectric devices, which means they must ‘float’ in the air.

This technology holds vast potential for various applications across multiple sectors, including medical devices, automotive electronics, and industrial electronics.

“This integrated UV light into our die bonder is a game changer for micro-electronics assembly,” said Wolfgang Plank, Head of the MOEMS Department at Escatec Switzerland. “This innovation is a testament to our commitment to leading the way in micro-assembly technology and our continuous effort to meet and exceed our clients’ expectations. We are excited about the new possibilities this technology opens for current and future applications”