Wireless SoCs Enhance Efficiency in IoT Applications

Silicon Labs has introduced the first products of its Series 3 portfolio, unveiling two new wireless SoC families, the SiXG301 and SiXG302, built on the advanced 22-nm process node. These wireless SoCs mark a significant leap in computing power, integration, security, and energy efficiency, catering to the growing demands of both line-powered and battery-operated IoT devices.

The Series 3 portfolio of multi-radio wireless SoCs boasts a common code base spanning over 30 devices, ensuring backward compatibility with Series 2. This facilitates scalability, efficient development, and application portability. The flexible manufacturing approach mitigates supply risks and offers memory options that future-proof designs. Series 3 also delivers over 100 times the processing capability, featuring an integrated AI/ML accelerator for edge devices, enabling system processing consolidation within these wireless SoCs.

Designed specifically for line-powered smart devices, the SiXG301 comes with an integrated LED pre-driver, making it ideal for advanced LED lighting and smart home products. It supports multi-protocol operation using Bluetooth, Zigbee, and Thread, with Matter compatibility. With a high Flash and RAM overhead of 4 MB and 512 kB, respectively, the SiXG301 helps future-proof customer designs as IoT applications evolve. Concurrent multi-protocol operation simplifies manufacturing SKUs, reduces costs, and saves board space for additional device integrations. The SiXG301 wireless SoCs are expected to be available in Q3 2025.

Expanding the Series 3 lineup to battery-powered applications, the upcoming SiXG302 wireless SoCs will offer groundbreaking energy efficiency without compromising performance. Featuring an advanced power architecture, the SiXG302 is designed to consume only 15 µA/MHz active current, 30% lower than competing devices in its class. This makes it ideal for battery-powered wireless sensors and actuators for both Matter and Bluetooth applications. Customer sampling of the SiXG302 is planned for 2026.

“Smart devices are becoming increasingly complex, and designers face the challenge of integrating more functionality into smaller spaces while maintaining energy efficiency,” said Ross Sabolcik, Senior Vice President of Product Lines at Silicon Labs. “With the SiXG301 and upcoming SiXG302 families, we are providing flexible, highly integrated solutions that enable next-generation IoT devices, whether they are plugged in or running on battery power.”

The SiXG301 and SiXG302 wireless SoCs will initially include "M" devices for multiprotocol support, such as the SiMG301 and SiMG302, and "B" devices optimized for Bluetooth LE communications, like the SiBG301 and SiBG302.