News Archive
Siemens partners with ESA EPIC for European space startups
Siemens has recently announced its participation in the European Space Agency’s (ESA) Partnership Initiative for Commercialisation (EPIC), with the goal of bolstering Europe’s burgeoning space startup ecosystem. This strategic move is intended to provide support to young space technology companies, enabling them...
Siemens names Ann Fairchild CEO of US operations
Siemens has officially named Ann Fairchild as the president and CEO of its U.S. operations, solidifying her position after serving as the interim leader since October 2025. This decision places a seasoned company executive at the forefront of Siemens’ largest market globally.The...
Microsoft and Victoria University Partner for Datacentre Academy
Microsoft has partnered with Victoria University (VU) to launch what is described as Victoria’s first datacentre academy, reflecting growing demand for skilled technicians as cloud and AI infrastructure scales. The facility, located at VU’s Footscray Nicholson Campus, is designed to provide hands-on...
NXP advances imaging radar with third-generation automotive transceiver
NXP Semiconductors has unveiled its third-generation automotive radar transceiver, the TEF8388, designed to provide higher-resolution sensing capabilities for advanced driver assistance systems and automated driving technologies. This new device integrates multiple transmit and receive channels into a single RFCMOS chip, aligning with...
Taoglas targets compact IoT designs with multi-radio antenna series
Taoglas has recently unveiled the FXP30x and PC30x series, a new line of compact embedded antennas that seamlessly integrate cellular, GNSS, and Wi-Fi connectivity into a single solution. These antennas are specifically designed for devices with limited space, where incorporating multiple radios...
Infineon targets AI power density with TLVR quad-phase module
Infineon Technologies has introduced what it describes as the industry’s first TLVR-based quad-phase power module exceeding 2 A/mm², aimed squarely at next-generation AI compute platforms. The new TDM24745T OptiMOS module integrates multiple power components into a compact footprint to address rising power...
STMicroelectronics and Leopard Imaging integrate multimodal vision module
STMicroelectronics and Leopard Imaging have collaborated to develop a cutting-edge multimodal vision module for advanced robotics, integrating multiple sensing capabilities into a single platform. This innovative module connects directly with NVIDIA’s robotics ecosystem, enhancing the perception capabilities of robots for various applications.Integrated...
Scrutiny Debugger Webinar for Real-Time Embedded Work
Elektor is set to host an engaging live webinar on Thursday, 9 April 2026, focusing on the Scrutiny Debugger, an innovative instrumentation-based tool designed for debugging, visualization, and testing in C/C++ embedded applications. The webinar, scheduled for 16:00 CEST (14:00 UTC), will...
Imec names Jensen Huang 2026 lifetime innovation award winner
Imec has named NVIDIA founder and CEO Jensen Huang as the recipient of its 2026 imec Lifetime of Innovation Award, recognizing his contributions to high-performance computing and artificial intelligence. The award highlights Huang’s role in developing GPU technology that has become central...
STMicroelectronics Expands Data Centre Power Portfolio
STMicroelectronics has expanded its 800 VDC power conversion portfolio for AI data centres, adding 12V and 6V architectures developed in line with NVIDIA’s reference design. The additions complement the company’s earlier 800 VDC to 50V stage and were highlighted at NVIDIA GTC...
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