A British wireless semiconductor innovator specialising in 5G Open RAN baseband technologies, RANsemi has launched its 5G Open RAN Starter Kit designed to enable out-of-the-box testing and accelerate the development of 5G radio access networks (RANs).The starter kit suits companies looking to...
Toshiba Electronics Europe GmbH has introduced seven new 32-bit microcontrollers (MCUs) with Arm® Cortex®-M4 cores, expanding its motor control lineup.The new MCUs are ideally suited for field-oriented control (FOC) of up to two AC motors, brushless DC (BLDC) motors and multiple types...
IAR has announced that IAR Embedded Workbench for Arm v9.60.3 supports the THA6 Gen2 series automotive-grade MCUs from Tongxin Microelectronics Co., Ltd., or TMC.The TMC THA6 Gen2 series is the first Arm Cortex-R52+ ASIL D MCU in China. Operating at a frequency...
Altium has completed the acquisition of Milwaukee-based Part Analytics for its leading AI-powered supply chain management platform, which enables manufacturers to quickly make fully informed decisions for large-scale component planning and procurement, particularly at the enterprise level.The acquisition will enable the introduction...
European universal chip designer Tachyum has added all four post-quantum cryptography (PQC) algorithms to the software distributions for its Prodigy processor.Adding the quantum-safe PQC algorithms, approved by the US National Institute of Standards and Technology as a global standard last August, ensures...
UK/US quantum company Quantinuum is to build a cutting-edge research and development hub in New Mexico for photonic technology.Quantinuum was formed from the merger of Cambridge Quantum Computing in the UK and Honeywell’s quantum business and is the largest dedicated quantum technology...
European universal chip designer Tachyum has added all four post-quantum cryptography (PQC) algorithms to the software distributions for its Prodigy processor.Adding the quantum-safe PQC algorithms, approved by the US National Institute of Standards and Technology as a global standard last August, ensures...
Keysight Technologies has added support for both interconnect standards to the latest version of its Chiplet PHY Designer 2025 design tool.The enhanced software introduces simulation capabilities for the Universal Chiplet Interconnect Expressä (UCIe) 2.0 standard and the Open Computer Project Bunch of Wires (BoW) standard.Chiplet PHY Designer enables...
TDK is backing stealth start-up NovoLinc for its high-performance thermal interface material for data centre chips.TDK ventures is investing in NovoLinc in Pittsburgh, Pennsylvania, that has used proprietary materials system and nanomechanical design to lower thermal resistance. The technology, originally developed at Carnegie Mellon...
Blue Cheetah Analog Design has taped outs designs of its next generation BlueLynx die-to-die (D2D) chiplet PHY on Samsung Foundry’s SF4X 4nm advanced manufacturing process.The latest PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbit/s. The...