News Archive
Three team for holographic HUD production
Eastman, Ceres Holographics and Covestro have signed a deal for commercial production of holographic head up display (HUD) technology.The Memorandum of Understanding (MOU) will explore commercial production of the Holographic In-Plane Transparent Display (HIPTD) laminated solution for automotive and transportation glazing applications...
ARM versus Qualcomm court case opens
The ARM versus Qualcomm trial began Monday with opening statements as the licensor-licensee partners wrestle over Qualcomm’s use of acquired IP.Qualcomm obtained chip designs that are now key to AI-smartphone and AI-PC ambitions through the purchase of startup Nuvia Inc. for US$1.9...
Honeywell looks to sell off aerospace business
Honeywell is exploring the potential separation of its Aerospace business.This comes after a profit warning and the acquisition of the Cobham Advanced Electronic Systems business (CAES) in September and a deal to supply avionics to Canadian aircraft maker Bombardier in December.This would...
X-FAB launches SiC process platform for power MOSFET designs
X-FAB Silicon Foundries SE has launched XSICM03, its next-generation XbloX platform, advancing SiC process technology for power MOSFETs, delivering significantly reduced cell pitch, enabling increased die per wafer and improved on-state resistance without compromising reliability.XbloX is a streamlined business process and technology...
sureCore and Sarcina join forces on cryogenic packaging
Following the recent launch of a range of cryogenic IP after the successful evaluation of test chips in both 180 nm and 22nm process nodes, sureCore has teamed with packaging experts, Sarcina, who designed a custom package specifically for use at cryogenic...
Four EU projects target 6G power efficiency
Four major 6G projects are launching in January 2025 targeting power efficiency in next generation telecoms networks.The projects include energy harvesting to power AI sensors as well as trials of energy-efficient 6G network technologies.Funded through the Smart Networks and Services Joint Undertaking...
Nokia and Elisa deploy commercial 5G Cloud RAN in European first
Nokia has successfully completed a commercial Cloud RAN deployment with the Finnish telcomms and digital service provider, Elisa in Espoo, Finland.Elisa can now deploy Nokia’s commercial Cloud RAN, which can co-exist with purpose-built networks in hybrid environments and evolve into full cloud-native...
65V, 2A buck LED driver for longer lighting chains
Diodes has launched an automotive-compliant synchronous Buck LED driver with high-side current sense drives up to 2A from a wide 4.5V to 65V input voltage range.The AL8891Q supports up to 95% duty cycle, allowing the drive of longer LED chains such as daytime...
sureCore teams with Sarcina to package cryo silicon
sureCore in the UK has teamed up with US packaging expert Sarcina Technology to develop a custom package for cryogenic silicon chips.This follows the successful evaluation of test chips in both 180 nm and 22nm process nodes for memory IP in quantum...
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