News Archive
AI Chiplets Boosted by Glass Substrate Alliance
An alliance of companies is aiming to boost the use of glass substrates for more complex AI chips and chiplets.The E-Core Alliance, led by E&R Engineering in Taiwan, has brought together over 15 companies to accelerate the development of large glass substrates....
Advancements in GaN Technology: 300mm Wafer Breakthrough
Shin-Etsu Chemical, a leading company in Japan, has recently unveiled a groundbreaking 300mm (12in) substrate designed specifically for GaN epitaxial growth. This innovative product has already entered the market in the form of samples, marking a significant advancement in the field of...
240W Charger Evaluation Board with Single-Stage PFC
Eggtronic, a company based in Italy, has recently unveiled an innovative evaluation board (EVB) tailored for smaller 240W power delivery (PD) 3.1 applications that require fast charging capabilities.The SmartEgg 240W PD 3.1 EVB charger design, developed by Eggtronic, boasts a peak efficiency...
Theion Launches Solid State Sulfur Battery Center
German battery company theion has recently inaugurated a cutting-edge Technology Centre in Berlin, signaling the commencement of customer evaluation for its innovative sulfur battery cells. Situated in the science and technology park in Adlershof, the theion centre is dedicated to the development...
Stellantis-Foxconn Venture Utilizes Siemens Tools
SiliconAuto, a joint venture of European car maker Stellantis and contract manufacturer Hon Hai Technology (Foxconn), has recently announced its adoption of the PAVE360 software from Siemens Digital Industries Software. This strategic move is aimed at reducing development time for the automotive...
Nokia and CommScope Collaborate on AI-Powered Wi-Fi and Fiber Connectivity
The collaboration between RUCKUS Networks and Nokia brings forth an innovative integrated fiber and Wi-Fi solution tailored to enhance end-user connectivity experiences in various settings such as multi-dwelling units (MDUs), hospitality, large public venues (LPVs), and educational institutions. This cutting-edge offering combines...
LG Partners with Blue Cheetah for AI Chiplet Design
Blue Cheetah Analog Design in the US and LG Electronics have joined forces to develop a cutting-edge generation of chiplets. This collaboration has already seen LG tape out silicon using the Blue Cheetah chiplet interconnect, paving the way for future AI-enabled products....
Volvo Partners with Blackwell GPU for Software-Defined Cars
Volvo Cars made a significant leap forward this week by introducing its first software-defined vehicle, powered by the cutting-edge Orin processor from Nvidia. The company also revealed plans to incorporate the Blackwell GPU architecture into its future models. This move marks a...
ROHM and UAES Collaborate on SiC Power Devices
ROHM and United Automotive Electronic Systems (UAES) have been working closely together, engaging in detailed technical exchanges focused on automotive applications utilizing silicon carbide (SiC) power devices. This collaboration reached a new milestone in 2020 with the establishment of the SiC Joint...
Advanced Wildfire Detection via Satellite Technology
Dryad Networks, a leading technology company based in Germany, has recently unveiled its latest innovation in the fight against wildfires. The third-generation Silvanet border and mesh gateways are designed to revolutionize early wildfire detection and forest management through satellite links.The new Silvanet...
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