News Archive
NIST Approves Post-Quantum Encryption Standards
The US National Institute for Standards and Technology (NIST) has officially approved a new set of encryption algorithms for post-quantum cryptography (PQC) standards. These PQC algorithms were selected by NIST from a competition over the last eight years and are now being...
Tech’s Tiny Marvel: Millions of Connections in a Square Millimeter of Silicon
Chipmakers are constantly pushing the boundaries of technology to make smaller and more powerful chips. However, a new approach involving larger components could revolutionize the industry in the next five years. This technology, known as hybrid bonding, involves stacking multiple chips on...
Farnell Introduces Low-Power Raspberry Pi Pico 2
The Raspberry Pi Pico 2 has been introduced, boasting the performance enhancements brought by the all-new RP2350 microcontroller, developed by Raspberry Pi. This latest iteration builds upon the success of the RP2040 microcontroller released in 2021, offering notable improvements across various aspects.Compared...
Eliyan Surpasses $100M Milestone in Chiplet Interconnect Technology
Chiplet interconnect pioneer Eliyan has reached a significant milestone by securing additional financial backing, bringing its total funding to over $100 million. This latest investment comes from VentureTech Alliance, following a successful Series B round in March that raised $60 million. The...
Microchip and Acacia Collaborate for Terabit-Scale Data Center Interconnect
The demand for higher bandwidths between data centers continues to grow rapidly, driven by the ever-increasing volume of traffic and the adoption of the latest data center architectures. To address this challenge, system developers are focusing on streamlining the development of a...
SweGaN Receives Orders for GaN-on-SiC Epitaxial Wafers
SweGaN AB, a leading semiconductor manufacturer, has announced a remarkable achievement in the first half of 2024. The company revealed that it has received orders totaling 17 MSEK for its QuanFINE® epitaxial wafers, including three major frame agreements from key players in...
New Automotive BLE 5.4 Chip for Wireless Battery Management Systems
Infineon Technologies has recently introduced eight new BLE Bluetooth devices to its Airoc range, catering to various applications including automotive systems. Among these additions is the Airoc CYW20829 BLE Bluetooth Low Energy 5.4 microcontroller (MCU) family, which comprises System-on-Chip (SoC) devices and...
SweGaN Begins GaN on SiC Wafer Deliveries
Swedish epitaxial specialist SweGaN is making significant strides in the semiconductor industry by starting to ship wafers with gallium nitride on silicon carbide (GaN on SiC) for high power RF applications in next-generation 5G Advanced networks.The company has recently secured three major...
Advanced 4kW IGBT Power Modules for Industrial Motor Drives
Infineon Technologies has introduced a cutting-edge intelligent power module (IPM) series designed for industrial motor drives up to 4kW, featuring the latest IGBT power devices.The Infineon CIPOS Maxi Intelligent Power Module (IPM) series is a groundbreaking development that combines 7th generation 1220V...
SkyWater Explores Fanout Packaging Innovation
US specialty chip maker SkyWater Technology is ramping up its fanout packaging technology to offer a new service to its customers. In the second quarter of this year, the company experienced a significant growth in revenues, reaching a record $93.3 million, a...
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