News Archive
Infineon’s new PSOC 4 integrates local processing for advanced EV battery management
Infineon Technologies AG has introduced the PSOC 4 HVPA-SPM 1.0, a cutting-edge automotive-grade microcontroller specifically engineered to enhance intelligence, precision, and safety in high-voltage Li-ion battery management systems for electric vehicles. This innovative device is designed to support the evolving zonal architectures...
Toshiba BLDC Motor Gate Driver IC
Toshiba has introduced commercial sample shipments of its TB9084FTG gate driver IC for three-phase BLDC motors, with a focus on automotive body electronics and auxiliary systems. This new device is an evolution of the TB9083FTG and is designed for compact motor control...
Renesas Achieves 9600 MT/s with Gen6 DDR5 RCD
Renesas Electronics has unveiled what it claims is the industry’s first sixth-generation Registered Clock Driver (RCD) for DDR5 RDIMMs, pushing performance to a record 9600 MT/s. The announcement marks a substantial leap beyond the company’s prior Gen5 device, which topped out at...
Tesla AI Chip Advancements
Tesla has outlined further steps in its in-house silicon programme, with CEO Elon Musk saying the company is close to completing the tape-out of its AI5 chip and has already begun work on the subsequent AI6 generation. The update, shared on X...
Firefly Ired Upgrade Enhances AR VR Eye-Tracking Performance
ams OSRAM has introduced a new generation of FIREFLY infrared LEDs — the SFH 4030B and SFH 4060B — designed to meet the rising performance demands of next-generation AR and VR devices. As immersive systems continue to push for higher efficiency, reduced...
SuperQ MOSFETs: New Safety Benchmark for High-Voltage Battery Packs
iDEAL Semiconductor has introduced its SuperQ MOSFET platform, a new power-device technology targeting the growing safety and efficiency challenges in 72-V-and-above battery management systems (BMS). The company notes in a release that it is positioning the first 150-V, 2.5-mΩ device as a...
GSMA Warns 6G Will Require Triple Mid-band Spectrum
A recent analysis by GSMA has raised concerns about the future of 6G mobile networks, highlighting the need for two to three times more mid-band spectrum than what is currently available. The report, titled Vision 2040: Spectrum for the Future of Mobile...
EU approves 450M boost for Onsemi’s SiC power chip plant
The European Commission has given the green light to a €450 million Czech support package aimed at Onsemi’s forthcoming Silicon Carbide (SiC) power semiconductor manufacturing plant in Rožnov pod Radhoštěm. This initiative will mark the establishment of the EU’s inaugural fully integrated...
IAR and Quintauris collaborate on functional safety software for RISC-V automotive systems
IAR and Quintauris have agreed to integrate IAR’s safety-certified development tools into the RT-Europa reference architecture, a RISC-V platform aimed at real-time automotive processors. The move potentially strengthens the tool support available to European engineers working on safety-critical ECUs and zonal architectures....
ECSA Releases 2025 Skills Strategy Report
The European Chips Skills Academy (ECSA) has recently unveiled its 2025 Skills Strategy Report, shedding light on the magnitude of the semiconductor workforce deficit in Europe. Prepared by DECISION Etudes & Conseil and overseen by SEMI Europe, the report presents updated data...
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