News Archive

UK Allocates £1.1 Million for UltraRAM Transfer Support

UK Allocates £1.1 Million for UltraRAM Transfer Support

UltraRAM, a groundbreaking memory technology, is revolutionizing the industry with its quantum resonant tunneling of electrons within a layered compound semiconductor structure that can be manufactured on silicon wafers. The brainchild of Professor Manus Hayne from the Physics Department at Lancaster University,...

Published on: July 16, 2024

Highly Durable 750W Buck DC-DC Converter with Conduction Cooling

Highly Durable 750W Buck DC-DC Converter with Conduction Cooling

TDK has introduced a new series of DC-DC converters ranging from 400W to 750W with conduction cooling, catering to a wide range of power needs.The TDK-Lambda RGB ruggedised non-isolated DC-DC converter series offers flexibility with input voltages of 9 to 18V, 18...

Published on: July 16, 2024

Advanced 3D ToF Sensor with Integrated Distance Calculation Circuit

Advanced 3D ToF Sensor with Integrated Distance Calculation Circuit

The Time-of-Flight (ToF) sensor developed by Nuvoton is set to transform the way people and objects are recognized in a variety of indoor and outdoor settings. This breakthrough is made possible by Nuvoton's innovative pixel design and advanced distance calculation and image...

Published on: July 16, 2024

Infineon and MediaTek Team Up for Affordable Infotainment Solutions

Infineon and MediaTek Team Up for Affordable Infotainment Solutions

In an effort to revolutionize automotive cockpits, Infineon and MediaTek have joined forces to introduce a cutting-edge solution that caters to the evolving needs of the industry. The collaboration between the two tech giants aims to address the shift towards digital cockpits...

Published on: July 16, 2024

Unlocking AI/ML Evaluation with Free Tools

Unlocking AI/ML Evaluation with Free Tools

The latest offering from Reality AI, the Explorer Tier, is set to revolutionize the way users access and evaluate the powerful features of Reality AI Tools. This new tier provides users with free access to a comprehensive, self-guided evaluation sandbox, allowing qualified...

Published on: July 16, 2024

Design Tool Growth Propels IP Market Forward

Design Tool Growth Propels IP Market Forward

The Electronic System Design (ESD) industry experienced a substantial revenue increase of 14.4% in the first quarter of 2024, reaching $4,521.6 million compared to $3,951.1 million in the same period of 2023. This growth trend is highlighted in the latest report from...

Published on: July 15, 2024

Extended Temperature Range for Single-Zone Direct ToF Sensor

Extended Temperature Range for Single-Zone Direct ToF Sensor

STMicroelectronics has recently unveiled a new single-zone Time-of-Flight (ToF) sensor, the ST VL53L4ED, designed for industrial and harsh environments with an extended operating temperature range from -40°C to 105°C.The ST VL53L4ED ToF sensor is capable of proximity detection and ranging up to...

Published on: July 15, 2024

Revolutionizing Electric Aircraft with Battery Innovation

Revolutionizing Electric Aircraft with Battery Innovation

Electric aircraft face a unique challenge when it comes to maintaining power delivery during landing with low charge. A recent study conducted by Lawrence Berkeley National Laboratory in collaboration with the University of Michigan has introduced a groundbreaking battery component innovation that...

Published on: July 15, 2024

SiliconInterventions Touts Fractal-D as Superior Audio Amplifier

SiliconInterventions Touts Fractal-D as Superior Audio Amplifier

IP licensor SiliconIntervention Inc. has recently unveiled the groundbreaking Fractal-D audio amplifier, touting its superior performance due to enhanced efficiency at low power levels. The company claims that Fractal-D is 60 to 70 percent more efficient at 1 percent of maximum power...

Published on: July 15, 2024

JEDEC Nears Completion of HBM4 Standard

JEDEC Nears Completion of HBM4 Standard

The High Bandwidth Memory 4 (HBM4) standard represents a significant advancement from its predecessor, HBM3, featuring a double channel per stack and a larger physical footprint. In a strategic move to facilitate adoption, JEDEC has ensured that a single controller can seamlessly...

Published on: July 15, 2024

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