News Archive
Gas Pump Developer Joins Forces for EV Charger Expansion
Gilbarco Veeder-Root, a leading provider of fueling and convenience store equipment, has announced a strategic partnership with SK Signet to develop an innovative EV charging system tailored for fuel retailers. The new Konect service is designed to offer a comprehensive electric vehicle...
Polar Semi Announces $525m Power Fab Expansion Under US Ownership
Polar Semiconductor, based in Bloomington, Minnesota, is making a significant investment of $525 million to double its capacity at its power fab. This move will result in the company shifting towards majority ownership in the US, a strategic decision aimed at strengthening...
SwissDrones Secures $10m for Pipeline Monitoring
SwissDrones, a leading provider of drone helicopters and data analytics solutions, has successfully raised $10 million in Series B funding. The investment round was led by a consortium of prominent investors, including DiamondStream Partners, Chevron Technology Ventures, and Ingleside Investors, along with...
Radar Distance Measurement and People Detection Adapter Board
Rutronik System Solutions has introduced a cutting-edge board designed for low power 60GHz radar-based distance measurements and people detection. The Rutronik RAB3 adapter board serves as a valuable tool for testing the functionality of a fully integrated module and exploring the potential...
CHIPS Act Boosting US Global Production Share: Report
Recent findings from a report prepared by Boston Consulting Group (BCG) for the US Semiconductor Industry Association reveal promising developments in the efforts to reduce reliance on Asia-based suppliers for chip manufacturing. The report indicates that these policy initiatives are showing positive...
AMS-Osram Seeks €200 Million Funding for Austrian Opto Fab
The European Chips Act has paved the way for AMS-Osram to secure a substantial funding application of €588 million (approximately US$630 million) to bolster chip research and development as well as manufacturing endeavors in Austria throughout the remainder of the decade. This...
Cutting-Edge: 3D-Printable High-Temperature Superalloy
NASA’s commitment to innovation in materials science has led to a groundbreaking development in the form of a superalloy designed to withstand the extreme conditions of air and spaceflight. This investment is now poised to yield significant commercial benefits, marking a milestone...
Immersive Engineering Expands with Spatial Content
Siemens and Sony Corporation have joined forces to unveil an innovative solution that merges Siemens Xcelerator industry software with Sony's cutting-edge XR head-mounted display (HMD), SRH-S1. This groundbreaking device was crafted using Siemens' NX software, a core tool utilized by Sony in...
SiPearl Collaborates with Samsung to Integrate HBM in Rhea
SiPearl, a European pioneer in high-performance computing (HPC) and artificial intelligence (AI) solutions, has recently announced a strategic collaboration with Samsung Electronics. After conducting an extensive market survey, SiPearl has chosen Samsung's High Bandwidth Memory (HBM) technology for its exceptional speed, energy-efficiency,...
Revolutionizing Implantable Medical Devices with Ultra-Low Power AI
In the realm of medical technology, a groundbreaking development has emerged from TTP in Cambridge. They have successfully created a low-power AI system tailored for implantable medical devices. This innovative AI framework is designed to analyze real-time ECG data and detect potential...
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