News Archive

Industrial Device Connectivity Mastery: PROFINET, EtherNet/IP, EtherCAT, and Cybersecurity

Industrial Device Connectivity Mastery: PROFINET, EtherNet/IP, EtherCAT, and Cybersecurity

Industrial device connectivity is a crucial aspect of modern automation systems, enabling seamless communication between various components in a manufacturing environment. To shed light on this topic, HMS Networks and Elektor are joining forces to host an exclusive live webinar on Tuesday,...

Published on: May 08, 2024

Unlocking Remote Access to Raspberry Pi

Unlocking Remote Access to Raspberry Pi

Raspberry Pi has introduced an innovative and user-friendly method for remotely accessing its latest boards from anywhere in the world, all through a simple web browser interface. This new feature, known as Raspberry Pi Connect, is designed to provide a secure and...

Published on: May 08, 2024

i.MX93 DART Module Enhances Edge Devices with AI Capabilities

i.MX93 DART Module Enhances Edge Devices with AI Capabilities

Variscite, a leading provider of embedded solutions, has recently unveiled a cutting-edge System on Module (SoM) featuring the powerful NXP i.MX93 processor along with the Ethos AI accelerator. The compact 55 x 30mm DART-MX93 module is specifically designed for machine learning applications...

Published on: May 08, 2024

Neuromorphic Supercomputer Targets 10 Billion Neurons

Neuromorphic Supercomputer Targets 10 Billion Neurons

SpiNNcloud Systems, based in Germany, is at the forefront of developing a groundbreaking neuromorphic supercomputer that boasts an impressive capacity of up to 10 billion neurons. This cutting-edge technology represents a significant leap forward in the field of artificial intelligence and computational...

Published on: May 08, 2024

IBM Releases Granite Code Models as Open Source

IBM Releases Granite Code Models as Open Source

IBM Research has been at the forefront of exploring the potential of artificial intelligence in simplifying the development and deployment of code. In a significant milestone in 2021, they introduced CodeNet, a vast dataset comprising 500 million lines of code across more...

Published on: May 08, 2024

Borophene: The Next Generation Material for Sensors and Medicine

Borophene: The Next Generation Material for Sensors and Medicine

Researchers at Penn State have recently achieved a significant breakthrough in the field of materials science by introducing chirality to borophene, a material with promising applications in advanced sensors and implantable medical devices. This innovative approach, never before utilized on borophene, has...

Published on: May 08, 2024

Partnership Enhances Autonomous Vehicle Testing with EOL and PTI Collaboration

Partnership Enhances Autonomous Vehicle Testing with EOL and PTI Collaboration

Ensuring the continued functionality of advanced driver assistance systems (ADAS) and autonomous driving (AD) features is crucial for the long-term safety and performance of vehicles. Manufacturers of vehicles equipped with these features must obtain certification, either from a third party, authority, or...

Published on: May 08, 2024

Partnership Expands Testing Capabilities for Autonomous Vehicles

Partnership Expands Testing Capabilities for Autonomous Vehicles

Ensuring the continued functionality of advanced driver assistance systems (ADAS) and autonomous driving (AD) features is crucial for long-term vehicle safety and performance. Manufacturers of vehicles equipped with these features must obtain certification, either from a third party, authority, or through self-certification....

Published on: May 08, 2024

Quantum Chip Achieves Cryogenic Milestone

Quantum Chip Achieves Cryogenic Milestone

A groundbreaking achievement in the field of quantum computing has been reached with the successful tape-out of a demonstrator chip designed to operate at cryogenic temperatures in the UK.The cryogenic chip is the result of a collaborative effort within a UK project...

Published on: May 08, 2024

Rapidus Collaborates with Fraunhofer on 2nm Packaging Tech

Rapidus Collaborates with Fraunhofer on 2nm Packaging Tech

Rapidus, a leading semiconductor company, has embarked on a groundbreaking collaboration with Fraunhofer IZM in Germany to develop cutting-edge packaging technology for its 2nm gate all around (GAA) chips. This partnership marks a significant milestone in the semiconductor industry, as both companies...

Published on: May 08, 2024

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