News Archive
sureCore Transitions SRAM Cores to 16nm FinFET Process
sureCore, a leading low power embedded SRAM IP specialist, has recently unveiled its PowerMiser ultra-low dynamic power memory compiler designed for 16nm processes. This new development is set to empower developers in meeting their power efficiency targets and fully leveraging the capabilities...
US and UK Join Forces on AI Safety with New MoU
The United States and the United Kingdom have taken a significant step forward in their collaboration on artificial intelligence (AI) safety testing. A Memorandum of Understanding (MoU) has been signed between the two countries to work together in developing tests for the...
X-Fab Enhances Optical Sensor Process with BSI Integration
X-FAB Silicon Foundries, the analogue/mixed-signal and specialty foundry, has recently announced the addition of a back-side illumination (BSI) capability to its XS018 180nm CMOS semiconductor process, specifically designed for optical sensors.By incorporating BSI technology, the performance characteristics of imaging devices can be...
Hynix Plans $3.9bn HBM Packaging Plant in Indiana
Hynix, a leading semiconductor manufacturer, has announced plans to construct a cutting-edge HBM packaging plant at the Purdue Research Park in West Lafayette, Indiana. The investment for this state-of-the-art facility is estimated at $3.9 billion, marking a significant milestone for the company's...
Launch of First C-LEO Programme Funding Call for Satellite Communications
The UK Government has initiated the first funding call for its C-LEO programme, aimed at enhancing the country’s satellite communications sector, following its announcement in the recent Spring Budget.With £60 million in funding set to be distributed over the next four years...
Optimised Edge AI and Cryptography with Accelerated RISC-V Core
Red Semiconductor has recently unveiled groundbreaking RISC-V instruction set extensions and a hardware design tailored for edge AI and cryptography applications in ASICs and FPGAs.The newly introduced hardware, named 'VISC', features an accelerated RISC-V core that excels in optimizing complex mathematical algorithms...
Hardware Secure Element Achieves FIPS 140-3 Level 3 Certification
NXP Semiconductors has recently unveiled a new hardware secure element that has been certified to FIPS 140-3. This certification is a significant milestone for the company, as it demonstrates their commitment to providing advanced security solutions for industrial IoT devices.The SE052F, as...
Driving Innovation: The Evolution of Automotive Connectors
Automotive connectors are indispensable components in the intricate circuitry of vehicles, playing a pivotal role in ensuring the seamless functioning of various systems within the vehicle. The reliability of these connectors directly impacts the overall performance and safety of the vehicle. With...
Intel’s Foundry Finances Unveiled
Intel’s foundry business is set to mark a significant milestone by reporting its first quarter as a separate division within Intel for the Q1 2024 quarter. This move comes as part of the company's strategic efforts to streamline operations and enhance transparency...
Hailo Secures $120m in Series C Funding
Hailo, the Israeli AI edge processor specialist, has recently secured an impressive $120 million in funding from a Series C round, bringing the company's total funding to a substantial $340 million. The investment comes from a variety of sources, including the Zisapel...
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