News Archive
SCALINX Secures €34m in Second Funding Round
SCALINX, the French fabless mixed signal specialist, has recently completed its second funding round, raising an impressive €34 million. This brings the company's total funding to €44.5 million, positioning SCALINX to expand its presence in the market and target new segments.The funding...
US Braces for Chinese Dumping of Legacy ICs
The United States is bracing itself for an influx of legacy integrated circuits (ICs) from China, as concerns grow over the potential impact on the global market. Two Congressmen have recently written to US Secretary for Commerce, Gina Raimondo, expressing their worries...
Unveiling the Gender Gap: Exploring the Lack of Funding for Female-Led Firms
Technology startups founded by women are facing significant challenges in securing equity funding, according to recent data. In the first half of 2023, these startups attracted a mere 3.5% of equity funding, while male-led companies received a staggering 73%. These figures highlight...
AI’s Quest: Finding the Perfect Solid Electrolyte for Li-ion Batteries
Microsoft and the US Pacific Northwest National Laboratory (PNNL) have joined forces in a multi-year project aimed at exploring material science using artificial intelligence (AI) and super-computing. As part of this collaboration, the team has made a breakthrough discovery of a promising...
CES Unveils New Energy Harvester for Small Solar Cells
E-peas, a leading technology company, has developed a groundbreaking energy harvesting integrated circuit (IC) specifically designed for hand-held remote controls and wireless keyboards equipped with small solar cells. This innovative IC allows for efficient energy conversion and utilization, ensuring optimal performance for...
Bosch Unveils Groundbreaking Achievement: World’s Smallest MEMS Accelerometers
Bosch Sensortec has recently announced the release of its latest innovation - the BMA530 and BMA580, which are touted as the world's smallest MEMS accelerometers. These cutting-edge sensors offer a range of features and applications, catering to the growing demand for smaller...
JEDEC Releases CAMM2: The New Standard for Memory Modules
JEDEC, the standards body for the microelectronics industry, has recently published a new JESD318 Compression Attached Memory Module (CAMM2) Common Standard. This standard outlines the electrical and mechanical requirements for Compression-Attached Memory Modules.The JESD318 CAMM2 standard covers two types of modules: Double...
Memory Prices Skyrocketing: What’s Behind the Surge?
Q1 NAND and DRAM prices are set to rise significantly, reports TrendForce.DRAM contract prices are estimated to increase by approximately 13–18% in 1Q24 with mobile DRAM leading the surge.Manufacturers believe that sustained production cuts are necessary to maintain the supply-demand balance in...
Intel Acquires Silicon Mobility: A Strategic Move in the Tech Industry
Intel, the renowned technology company, has announced its plans to acquire Silicon Mobility, a French fabless silicon and software company specializing in System-on-Chips (SoCs) for intelligent Electric Vehicle (EV) energy management. This strategic move by Intel aligns with its sustainability goals and...
NXP Paves the Way for Software-Defined Radar Technology
NXP Semiconductors has unveiled an extension to its 28nm RF CMOS radar one-chip SoC family at the Consumer Electronics Show (CES) in Las Vegas. The new SAF86xx SoC is the successor to the SAF8500 and is specifically designed for smart radar sensors.The...
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