News Archive
Ceva NeuPro-Nano Wins AI Category at Embedded Award 2026
At the embedded world Exhibition&Conference in Nuremberg, Ceva’s NeuPro-Nano AI processor has been named the winner in the artificial intelligence category of the embedded award 2026. The award recognises technologies considered to represent significant advances in embedded system design and development.The NeuPro-Nano...
Renesas Enhances Automotive SoC Technologies for Multi-Domain ECUs in SDV Architectures
Automotive semiconductor design is becoming increasingly complex, as highlighted by recent developments in chip architecture, power management, and AI acceleration. These elements are crucial in shaping the next generation of vehicle computing platforms, reflecting the evolving requirements of software-defined vehicles (SDVs).Chiplet architecture...
Exploring Embedded Systems, AI, and New Frontiers
March has become closely associated with “embedded” for several reasons. As always, the embedded world trade show takes place this month. If you attend the event in early March, you will likely spot Elektor engineers and editors on the show floor filming...
Intel Introduces Core Series 2 Processor, Expands Edge AI Portfolio
Intel has unveiled a new industrial-ready processor platform tailored for real-time edge workloads, in addition to a healthcare-focused AI development suite. The company made these announcements at embedded world 2026 in Nuremberg, underscoring its increasing emphasis on edge computing and AI-enabled applications.For...
Applications open for electronica Fast Forward 2026 startup platform
Applications are now open for electronica Fast Forward 2026, the official startup platform of the electronica trade fair in Munich. The upcoming edition marks the program’s tenth anniversary, highlighting a decade of connecting deep-tech and hardware startups with investors, industry partners, and...
ROHM GaN licensing brings TSMC process to Hamamatsu
ROHM is making a significant move by incorporating TSMC’s gallium nitride process technology into its own manufacturing flow. This decision sheds light on the direction in which the power-device market is evolving. Through a new license agreement, the Japanese chipmaker plans to...
Synopsys unveils electronics digital twin platform for AI-driven systems
Synopsys has introduced a groundbreaking open electronics digital twin platform aimed at expediting the development of software-defined products and physical AI systems. This innovative platform empowers engineering teams to construct and oversee virtual replicas of intricate electronics systems at an earlier stage...
MIPS and INOVA unveil physical AI reference platform for robotics
MIPS and Inova Semiconductors have collaborated to introduce a new reference platform aimed at expediting the development of robotics and physical AI systems. The platform is specifically designed to streamline the architecture of advanced robotic systems, particularly humanoids, by reducing size, power...
Wurth Elektronik and Grinn collaborate on edge AI solutions
Würth Elektronik and embedded systems developer Grinn have joined forces in an exciting collaboration announced at embedded world 2026. The first fruit of this partnership is the Grinn GenioBoard – Edge AI SBC single-board computer, which will be showcased at booth 110...
TI and NVIDIA team up to accelerate humanoid robot safety
Collaboration between Texas Instruments (TI) and NVIDIA is set to revolutionize the development and deployment of humanoid robots. By combining sensing, real-time control, and AI compute technologies, the partnership aims to accelerate the transition of robotics developers from simulation to real-world applications....
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