Under-bump metallization (UBM)
09/05/2024, hardwarebee
Under-bump metallization (UBM) is a critical aspect of the functionality of Semiconductor devices, forming the crucial connections between integrated circuits and the outside world. This intricate process plays a vital role in ensuring that electronic components operate with precision, particularly in the context of the ever-shrinking size of devices and increasing demands for performance. In this article, we will delve into the technicalities of under-bump metallization, exploring its structure, components, and the methods by which it is implemented.
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