AI and HPC Applications Empowered by New Power Delivery Platform

Empower Semiconductor has introduced the Crescendo platform, a groundbreaking innovation in AI power delivery. Leveraging the company’s proprietary FinFast™ technology, Crescendo offers scalable on-demand true vertical power delivery for over 3,000 A power domains. This platform provides a unique combination of system efficiency, current density, and nanoseconds transient response, addressing the increasing power and speed demands of modern data center workloads.

Traditional lateral power systems are no longer sufficient to meet the efficiency requirements of today's data centers. These systems operate slowly, resulting in bulky power stages and magnetics on the PCB. Additionally, the need for large capacitor banks near the processor leads to substantial lateral transmission power losses. The rise in transmission losses due to the power increase of new AI chips poses a significant challenge for the industry.

Crescendo revolutionizes power delivery by eliminating the capacitor bank and energy storage requirements. It provides energy on demand to the AI chip with unprecedented speed and accuracy. By removing the capacitors, Crescendo's high-density and ultrathin thermally enhanced package fits under the processor, delivering vertically coupled power to the AI chip and eliminating lateral transmission loss.

The FinFast™ technology at the core of Crescendo operates with benchmark efficiency at high speeds. It combines cutting-edge silicon with novel control architectures, high-frequency magnetics, wide-bandwidth capacitors, and best-in-class power packaging. The integration of these technologies results in a dense and efficient AI power delivery solution.

Tim Phillips, founder and CEO of Empower Semiconductor, highlighted the significance of the Crescendo platform in meeting the escalating power requirements of AI processors. He stated, “With this introduction, we are enabling efficient true vertical power delivery for our customers. The Crescendo platform will allow the integration of power delivery directly into the processor at total power supply densities exceeding 5-A/mm2.”