China’s Silex Unveils 300mm Wafer MEMS Fab Plan

Chinese-owned Silex Microsystems AB, based in Järfälla, Sweden, has made a significant announcement regarding its expansion plans. The company, known as the world's largest pure-play foundry for MEMS components, is set to construct a state-of-the-art 300mm wafer fab. This new facility will be strategically located near Silex's existing 200mm wafer fab at its headquarters in Järfälla, Sweden. The primary objective of the new fab is to facilitate the wafer-level integration of CMOS and MEMS die, as outlined in a recent company statement.

Edvard Kälvesten, the CEO and founder of Silex, expressed his enthusiasm for the upcoming development, stating, "The introduction of this new wafer size will vastly increase production capacity as we work to realize the innovations of the world's leading MEMS innovators." Kälvesten emphasized Silex's commitment to technological advancement, highlighting the company's dedication to maintaining a leading position in the global pure-play MEMS foundry market.

Despite the exciting prospects associated with the new wafer fab, specific details regarding its construction, manufacturing capacity, and production commencement date have not been disclosed by the company. However, industry experts suggest that the cost of establishing a wafer fab for MEMS applications is relatively lower compared to fabs dedicated to advanced logic production. For instance, Menlo Microsystems Inc., a former customer of Silex, has allocated US$50 million for the development of a MEMS wafer fab in Ithaca, New York, focusing on RF and power switches. The production at this facility is scheduled to commence in 2024.

Following its acquisition by Chinese interests in 2015, Silex Microsystems now operates as a subsidiary of Sai Microelectronics Inc., a company listed on the Shenzhen stock exchange. This strategic move has positioned Silex to leverage the resources and expertise of its parent company to further enhance its capabilities and market presence in the MEMS foundry sector.

In conclusion, Silex Microsystems' decision to establish a cutting-edge 300mm wafer fab underscores its commitment to innovation and growth in the MEMS industry. By integrating CMOS and MEMS die at the wafer level, the company aims to meet the evolving demands of MEMS innovators worldwide. With the support of its parent company, Sai Microelectronics Inc., Silex is poised to strengthen its position as a leading player in the global MEMS foundry market, driving advancements in technology and manufacturing processes.