Consumer-Friendly Edge AI Package Unveiled

AI accelerator developer Femtosense has recently introduced a groundbreaking system in package (SiP) designed specifically for consumer applications. The AI-ADAM-100 SIP is a fusion of the Femtosense Sparse Processing Unit 001 (SPU-001), a neural processing unit (NPU), and an ARM Cortex M0+ microcontroller from Abov Semiconductor. This innovative combination enables edge AI voice processing and voice-cleanup capabilities, catering to the evolving needs of the consumer market.

Following a strategic partnership agreement inked between Femtosense and Abov at the CES show in January, the development of the AI-ADAM-100 SIP has been fast-tracked. Sam Fok, CEO of Femtosense, highlighted the efficiency of combining the SPU001 die with MCU in a SiP package as a key factor in the rapid deployment of this cutting-edge technology.

The Abov 40nm M0+ microcontroller, equipped with 8Kbytes of SRAM and 32Kbytes of embedded flash, serves as the controller in the AI-ADAM-100. Leveraging the 1Mbit of SRAM in the 22nm SPU-001 for overflow purposes, such as recording voice data for an always-on system, enhances the device's functionality and performance.

With a focus on cost-effectiveness, the AI-ADAM-100 marks the beginning of a series of SiP devices utilizing microcontrollers with ARM M4 and M7 microcontrollers. Fok emphasized that cost is the primary driver behind this innovation, targeting consumer equipment with power consumption ranging from 250uW to 5mW.

The SIP, constructed using an organic substrate and assembled by Winpak, offers a glimpse into the future of AI technology in consumer electronics. The collaboration between Femtosense, Abov, and Winpak underscores a commitment to delivering energy-efficient solutions that enhance the functionality of home appliances.