Cutting-Edge Magpack Module Utilizes 3D Inductor Technology

Texas Instruments has recently unveiled a groundbreaking development in power module technology with the introduction of a 3D inductor that can be molded around a power chip. This innovative approach not only results in a smaller module but also significantly reduces electromagnetic interference (EMI).

The 3D inductor, part of TI's Magpack technology, is crafted using a proprietary material that enables a 6A power module. This new module boasts an impressive 8dB reduction in EMI and a 2% improvement in efficiency compared to TI's previous offerings. What sets this technology apart is its compact size, being up to 50% smaller than the company's previous modules.

Roja de Cande, product line manager at TI, emphasized the significance of integrating a power chip with a transformer in a single package. This integration is crucial in addressing the evolving power landscape where space constraints continue to challenge designers year after year.

Among the six new devices introduced by Texas Instruments, the TPSM82866A, TPSM82866C, and TPSM82816 stand out as the industry's smallest 6A power modules, boasting a power density of nearly 1A per 1mm² of area. Anton Winkler, a system engineer at TI, highlighted the use of 3D package molding to maximize the package area and integrate the inductor over the chip with new material.

TI's internal assembly and packaging process ensure that the inductor is finely tuned to meet the silicon's requirements. By adjusting the inductor based on the switching frequency, the efficiency is enhanced across the entire load range. The modules cover currents ranging from 3A to 6A, offering improved thermal management and a significant reduction in size compared to competing modules.