NEO Semiconductor Unveils 3D Memory with AI Processing

NEO Semiconductor has introduced a groundbreaking technology called 3D X-AI, which is set to transform the landscape of artificial intelligence (AI) chip design. Built upon NEO's award-winning 3D X-DRAM™ technology, 3D X-AI is designed to simulate artificial neural networks (ANNs) by incorporating synapses for weight data storage and neurons for data processing. This innovative approach positions 3D X-AI as a key player in accelerating the development of next-generation AI chips and applications.

A single 3D X-AI die boasts an impressive 300 layers of 3D memory with a capacity of 128 Gb (gigabits), along with a layer of neural circuitry featuring 8,000 neurons. This configuration enables each die to support up to 10 TB/s (terabytes per second) of AI processing throughput. By stacking twelve 3D X-AI dies with HBM packaging, the capacity and performance of the 3D X-AI chip can be scaled up to 1,536 Gb (192 GB) capacity and 120 TB/s processing throughput, representing a 12x increase in capabilities.

Andy Hsu, the Founder & CEO of NEO Semiconductor, highlighted the limitations of traditional AI chips that rely on processor-based neural networks. These chips typically use high-bandwidth memory to simulate synapses for storing weight data and graphical processing units (GPUs) to simulate neurons for mathematical calculations. However, the performance of such chips is hindered by the data transfer bottleneck between HBM and GPU, leading to decreased efficiency and increased power consumption.

Conversely, AI chips equipped with 3D X-AI technology leverage memory-based neural networks, integrating synapses and neurons within each 3D X-AI chip. This design significantly reduces the heavy workload associated with data transfer between the GPU and HBM during AI operations. By streamlining this process, 3D X-AI enhances AI chip performance and sustainability, offering a more efficient and effective solution for AI workload optimization.

With its potential to revolutionize AI chip design and enhance the performance of AI applications, 3D X-AI represents a major advancement in the field of artificial intelligence. By addressing key challenges related to data transfer and processing efficiency, NEO Semiconductor's innovative technology is poised to drive the evolution of AI chips and pave the way for new possibilities in AI-driven technologies.