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Novel OLED stacks yield very bright microdisplays

Novel OLED stacks yield very bright microdisplays

Researchers at the Fraunhofer Institute for Photonic Microsystems IPMS have developed novel OLED stacks that enable exceptionally bright microdisplays.The development lends itself to use in augmented reality (AR) glasses, which require especially bright displays in daylight to clearly recognize content. High brightness...

Published on: January 14, 2025

3D printed intricate antennas

3D printed intricate antennas

A new 3D printing/additive manufacturing platform that offers “unparalleled flexibility in antenna design and the capability for rapid printing of intricate antenna structures.”As reported in the latest issue of Nature Communications, the new platform—dubbed “charge programmed multi-material 3D printing” (CPD)—is a universal...

Published on: January 14, 2025

Collaboration offers OTA testing of next-generation WLAN devices

Collaboration offers OTA testing of next-generation WLAN devices

Extending their long-established collaboration, Bluetest and Rohde & Schwarz have integrated the Wi-Fi 7 test functionality of the CMX500 one-box signaling tester into the Bluetest Flow control software. Now, developers and manufacturers of next-generation WLAN technology can use the Bluetest reverberation test...

Published on: January 14, 2025

€20m for imec MRAM in-memory compute chiplet spinout

€20m for imec MRAM in-memory compute chiplet spinout

Vertical Compute has raised €20m to commercialise MRAM in-memory computing chiplet technology developed at imec in Belgium.The chiplet is expected to be based on spin MRAM technology developed at imec which can reduce power consumption by 80% and speed up the execution...

Published on: January 14, 2025

Work starts on VITA 100 embedded computing standard

Work starts on VITA 100 embedded computing standard

The VITA trade group has several working groups for the VITA 100 next generation high performance OpenVPX embedded computing standard.The VITA 100 working groups are currently defining a suite of standards as an evolution for OpenVPX, VPX and related mechanical standards.This aims...

Published on: January 14, 2025

Chinese cabin platform adds Qualcomm Snapdragon AI

Chinese cabin platform adds Qualcomm Snapdragon AI

Chinese tier one supplier Desay SV is using the Snapdragon Cockpit Elite chipset from Qualcomm Technologies for its latest AI-enabled cabin platform.The G10PH intelligent cabin platform will be powered by Qualcomm chipset with the Oryon CPU, Hexagon NPU for accelerated AI performance and...

Published on: January 13, 2025

TriLite moves its smart glasses display into automotive

TriLite moves its smart glasses display into automotive

Austrian smart glasses technology developer TriLite is showing an automotive application for its ultra-compact projection display.Alongside live demonstrations of its augmented reality (AR) smart glasses, powered by Trixel 3, TrLite will also show free space projection technology, enabling dynamic projections on any...

Published on: January 13, 2025

A new ultrathin conductor for nanoelectronics

A new ultrathin conductor for nanoelectronics

Researchers at Stanford Engineering have developed an ultrathin material that conducts electricity better than copper and could enable more energy-efficient nanoelectronicsAs computer chips continue to get smaller and more complex, the ultrathin metallic wires that carry electrical signals within these chips have...

Published on: January 13, 2025

New discovery makes organic solar cells more efficient and stable

New discovery makes organic solar cells more efficient and stable

Researchers at Åbo Akademi University have identified and eliminated a previously unknown loss mechanism in organic solar cells that makes them more efficient and gives them a longer lifetime. The results provide new insight into how efficiency and stability can be increased...

Published on: January 13, 2025

Rapidus plans to send 2nm chips to Broadcom in June, says report

Rapidus plans to send 2nm chips to Broadcom in June, says report

Japanese startup foundry Rapidus Inc. is planning to supply a 2nm prototype IC to US fabless chip company Broadcom in June, according to Nikkei.The supply is part of push by Rapidus to secure customers for its foundry offering, which is based on...

Published on: January 13, 2025

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