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Electronic Breaking News

Semidynamics RISC-V AI IP selected for LLM application

Semidynamics RISC-V AI IP selected for LLM application

A leading IP company for high performance, AI-enabled, RISC-V processors, Semidynamics has announced that it has been selected by UPMEM as its core provider for its next generation of LPDDR5X Processing In Memory (PIM) device.The standard RISC-V architecture with the integrated Tensor...

Published on: December 09, 2024

Sondrel ships complete turnkey AI accelerator chip

Sondrel ships complete turnkey AI accelerator chip

UK design house Sondrel is shipping its first chip produced under a full turnkey contract of concept to silicon.The AI accelerator chip was developed for a US customer on a leading edge node and is a step beyond the previous Sondrel ASIC...

Published on: December 09, 2024

Leaftronics reloaded: Leaf-inspired solution for sustainable water treatment

Leaftronics reloaded: Leaf-inspired solution for sustainable water treatment

As the team reports in the renowned scientific journal “NJP Flexible Electronics”, they aim to use the nature-inspired “Leaftronics” design in combination with a unique metallization process for an innovative and ecological form of water treatmentLeaf structures exhibit fractal patterns that evolved...

Published on: December 08, 2024

Imec shows double row CFET standard cell for A7 process node

Imec shows double row CFET standard cell for A7 process node

imec in Belgium is proposing a standard cell architecture for logic and SRAM on a 0.7nm CMOS A7 process and has developed a prototype device on its 300mm wafer line.Intel, TSMC and Samsung are currently pushing their processes to 1.8nm (18A) and...

Published on: December 07, 2024

Americas chip market soars as Asian growth slows

Americas chip market soars as Asian growth slows

There was a glimmer of an upturn for Europe buried in recently published chip market sales data for October that showed the Americas region up by more than 50 percent year-on-year.The Americas chip market accelerated to a three-month average figure of US$18.67...

Published on: December 07, 2024

First 3.5D face-to-face packaging for AI processors

First 3.5D face-to-face packaging for AI processors

Broadcom has combined 3D silicon stacking and 2.5D face-to-face packaging technology for AI processors for the first time.The 3.5D eXtreme Dimension System in Package (XDSiP) technology integrates more than 6000 mm2 of silicon and up to 12 high bandwidth memory (HBM) stacks...

Published on: December 07, 2024

First 3.5D face to face packaging for AI processors

First 3.5D face to face packaging for AI processors

Broadcom has combined 3D silicon stacking and 2.5D face-to-face packaging technology for AI processors for the first time.The 3.5D eXtreme Dimension System in Package (XDSiP) technology integrates more than 6000 mm2 of silicon and up to 12 high bandwidth memory (HBM) stacks...

Published on: December 06, 2024

X-fab grabs $50m cash for Lubbock SiC fab

X-fab grabs $50m cash for Lubbock SiC fab

The roll out of grants for semiconductor plants in the last stages of the US CHIPS Act continues with $50m for the silicon carbide (SiC) power device fab in Lubbock Texas run by X-fab of Belgium.The latest agreements also include $33m for...

Published on: December 06, 2024

Stellantis signs Zeta Energy for lithium sulfur EV batteries

Stellantis signs Zeta Energy for lithium sulfur EV batteries

European car maker Stellantis has signed a deal to develop fast charging lithium sulfur batteries that could be lighter and cost less than half the price per kWh of current lithium-ion batteries.The deal with Zeta Energy in the US includes both pre-production...

Published on: December 06, 2024

Intel re-affirms “product-and-foundry” strategy with director appointments

Intel re-affirms “product-and-foundry” strategy with director appointments

Troubled US chip gaint Intel Corp. has announced that Eric Meurice, former CEO of ASML Holding NV, and Steve Sanghi, chair and interim CEO of Microchip Technology Inc., have been appointed to Intel’s board of directors with immediate effect.Both will serve as...

Published on: December 06, 2024

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