TRUMPower has introduced a cutting-edge 100W medical power adapter to cater to the increasing demand for devices utilizing USB Type C technology. The TMW100CU and TMW100CI wall mount adapter series have received approval for both the latest medical and ITE standards. These...
Published on: April 25, 2025
AstroForge, a space exploration company based in the US, has recently partnered with Kulr to utilize their space-qualified 500Wh battery pack and battery management system for an upcoming asteroid mining mission. The Kulr ONE Space (K1S) battery pack incorporates established modules and...
Published on: April 25, 2025
BrainChip and Andes Technology have joined forces to integrate Neuromorphic AI IP with RISC-V cores, resulting in a powerful collaboration that promises to advance edge AI capabilities. The Akida AKD1500 chip, built on 22nm FD-SOI technology, has been seamlessly integrated into the...
Published on: April 25, 2025
Revolutionizing AI Response Engines: ETH Zurich Researchers Develop Innovative MethodResearchers at the Institute for Machine Learning in the Department of Computer Science at ETH Zurich have made a groundbreaking advancement in the realm of artificial intelligence. They have devised a method to...
Published on: April 24, 2025
Microchip Technology has introduced a cutting-edge point-of-load 12A power module designed specifically for edge AI applications. The MCPF1412 power module features a 16V VIN buck converter and supports I2C and PMBus interfaces, catering to the unique requirements of edge AI designs.With a...
Published on: April 24, 2025
Mitsubishi Electric Corporation and Nanofiber Quantum Technologies have announced a collaborative project focused on the development of neutral-atom quantum computer interconnection technologies. The primary objective of this project is to create core optical quantum interface technologies that will combine qubit control and...
Published on: April 24, 2025
Researchers at MIT have made a breakthrough in the field of thermal sensing by developing a technique to create ultra-thin pyroelectric films that can operate at room temperature. This advancement opens up new possibilities for highly sensitive thermal sensors that can be...
Published on: April 24, 2025
IQM is making strides in the field of quantum computing by installing a 5-qubit superconducting quantum computer at the Wrocław University of Science and Technology (WUST), marking a significant milestone as the first of its kind in Poland. The IQM Spark machine...
Published on: April 24, 2025
Intel has made a significant advancement in utilizing chiplets for its second generation software-defined vehicle system-on-chip (SoC) device. Unveiled at the Shanghai 2025 Auto Show, this SoC integrates chiplets constructed on various process technologies to offer extensive language model AI support, enhanced...
Published on: April 23, 2025
The Technical University of Eindhoven (TU/e) has recently unveiled a groundbreaking test-bed for super-fast wireless data transfer using infrared light. While data transmission via light is not a new concept, this innovative test environment allows for the transfer of massive amounts of...
Published on: April 23, 2025