Electronic Breaking News

Morse Micro and Vantron to drive IoT with Wi-Fi HaLow

Morse Micro and Vantron to drive IoT with Wi-Fi HaLow

Vantron Technology has announced a strategic partnership with Morse Micro to drive innovation and excellence in the application of Wi-Fi HaLow, further revolutionizing IoT connectivity.Through the partnership, the two companies will work together to provide robust and energy-efficient connectivity that meets the...

Published on: November 18, 2024

Esperanto, NEC team on RISC-V supercomputers

Esperanto, NEC team on RISC-V supercomputers

RISC-V processor developer Esperanto Technologies Inc. (Mountain View, Calif.) is working with Japan’s NEC Corp. on a roadmap for chips and software for high-performance computing.The two companies will be working on the architecture supercomputers based on the RISC-V instruction set. The cooperation...

Published on: November 18, 2024

MediaTek fires the starting gun on WiFi 8

MediaTek fires the starting gun on WiFi 8

MediaTek has early prototypes of chips for the next generation IEEE802.11bn WiFi 8 standard.WiFi 7, or 802.11be, was approved in September, but chips have been available for the last two years. The four year cycle means that WiFi8 chips will be ready...

Published on: November 18, 2024

e2v preps 15-core AI processor for space

e2v preps 15-core AI processor for space

Teledyne e2v in Grenoble is radiation testing a multicore ARM processor for space designs.The LX2160 has 15 ARM Cortex-A72 processor cores that provide 200k DMIPs of performance for servers and AI processing in space.The chip uses the  WRIOP capable to handle high-speed...

Published on: November 18, 2024

SK Hynix prepares 16-layer HBM3e DRAM for 2025

SK Hynix prepares 16-layer HBM3e DRAM for 2025

SK Hynix has announced that its 16-layer HBM3e DRAM will be available in 2025. The device is expected to sample in 1H25.The company’s CEO, Kwak Noh-Jung, announced the development of the 16-layer HBM3e memory with a capacity of 48Gbytes at the SK...

Published on: November 18, 2024

Radiation-hardened-by-design 512 Mbit QML-qualified NOR flash memory

Radiation-hardened-by-design 512 Mbit QML-qualified NOR flash memory

Infineon Technologies AG has announced the first radiation-hardened-by-design 512 Mbit QSPI NOR Flash memory for space and extreme environment applications. It offers a fast quad serial peripheral interface (133 MHz) and the highest density, radiation, and single-event effects (SEE) performance available in...

Published on: November 18, 2024

IEC 62443 certification service cuts IoT security costs

IEC 62443 certification service cuts IoT security costs

Advantech has launched its IEC 62443 Certification Service, which targets needs of edge computing equipment in accordance with IEC 62443 and related standards. Advantech has joined forces with Bureau Veritas, a global leader in testing, inspection, and certification, to provide this certification...

Published on: November 18, 2024

IQE mulls sale of Taiwan operations amid slow chip equipment market

IQE mulls sale of Taiwan operations amid slow chip equipment market

Epitaxial wafer supplier IQE plc (Cardiff, Wales) has announced a trading update and comprehensive strategic review of operations.The company said that it now expects revenue for the full-year 2024 to December 31, to be flat compared with 2023 at about £115 million...

Published on: November 18, 2024

Gregg Lowe ousted as Wolfspeed CEO

Gregg Lowe ousted as Wolfspeed CEO

Gregg Lowe is to step down as President & CEO at Wolfspeed and as a Member of the Board of Directors later this month.Current Chairman Thomas Werner will act as Executive Chairman during the search process to find a new chief executive.Despite...

Published on: November 18, 2024

RedCap IoT module balances 5G performance and cost

RedCap IoT module balances 5G performance and cost

SIMCom in China has launched a RedCap (reduced capability) cellular module range for the Internet of Things (IoT) where full 5G performance is not required.The SIM8230 is a multi-band 5G NR/LTE-FDD/LTE-TDD module which supports R17 5G stand alone (SA) protocols. Interfaces include...

Published on: November 18, 2024