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Compact 3D low-power ToF sensor delivers high performance

Compact 3D low-power ToF sensor delivers high performance

TOPPAN Holdings developed its first-generation 3D ToF (Time of flight) sensor for robotics in 2023, using hybrid ToF™ technology to enable long-range measurement, tolerance to outdoor environments, high-speed sensing, and simultaneous use of multiple devices.The company has now further enhanced the first-generation’s...

Published on: November 20, 2024

First complete memory interface for next generation DDR5 server MRDIMMs

First complete memory interface for next generation DDR5 server MRDIMMs

Renesas Electronics Corporation has delivered the industry’s first complete memory interface chipset for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).New DDR5 MRDIMMs are needed to keep pace with the ever-increasing memory bandwidth demands of AI, HPC and other data...

Published on: November 20, 2024

Report: Robotics advances to drive human-machine collaboration

Report: Robotics advances to drive human-machine collaboration

Molex has issued a thought leadership report that looks at the future potential of robotics, resulting in more intuitive, intelligent and interconnected human-machine communications and collaborations.The report considers a future where highly advanced robotics systems and multipurpose robots transform fundamental aspects of...

Published on: November 20, 2024

New on-chip device uses exotic light to detect molecules

New on-chip device uses exotic light to detect molecules

The compact design and room-temperature operation of the device hold promise for developing ultra-compact platforms for molecular and gas sensing applications – ICFO newsResearchers have developed a highly sensitive detector for identifying molecules via their infrared vibrational “fingerprint”. Published in Nature Communications,...

Published on: November 20, 2024

D-Wave shows 4400 qubit annealing quantum processor

D-Wave shows 4400 qubit annealing quantum processor

D-Wave in Canada has completed the calibration and benchmarking of a 4,400+ qubit annealing processor.The Advantage2 will be key to D-Wave’s ongoing development of its sixth-generation annealing quantum computing system with a substantial performance boost over the current Advantage system for optimization,...

Published on: November 20, 2024

First room-temperature quantum computer in Europe

First room-temperature quantum computer in Europe

Fraunhofer Applied Solid State Physics (IAF) in Germany is to install a room temperature quantum computer from Quantum Brilliance, the first in Europe.The purchase of its second-generation Quantum Development Kit (QB-QDK2.0) adds to the existing software suite at Fraunhofer IAF. This includes the...

Published on: November 20, 2024

First room temperature quantum computer in Europe

First room temperature quantum computer in Europe

Fraunhofer Applied Solid State Physics (IAF) in Germany is to install a room temperature quantum computer from Quantum Brilliance, the first in Europe.The purchase of its second-generation Quantum Development Kit (QB-QDK2.0) adds to the existing software suite at Fraunhofer IAF. This includes the...

Published on: November 20, 2024

$1bn US semiconductor digital twin centre approved

$1bn US semiconductor digital twin centre approved

The US government is to back a $1bn semiconductor digital twin centre with a $285m grant.The Semiconductor Manufacturing and Advanced Research with Twins (SMART) centre will be based in Durham, North Carolina, with over 150 expected partners across industry, academia, and the...

Published on: November 20, 2024

First DDS provider to meet all major automotive software standards

First DDS provider to meet all major automotive software standards

Real Time Innovations (RTI) has achieved all the major automotive software safety standards for its DDS publish-subscribe interconnect software.RTI Connext Drive has met all automotive industry quality standards by achieving ASPICE CL1, ISO 21434, and ISO 26262 process certifications. The Data Distribution Service (DDS) standard for pusblish-subscribe architectures...

Published on: November 19, 2024

SuperNIC startup Enfabrica raises US$115 million in Series C

SuperNIC startup Enfabrica raises US$115 million in Series C

Networking chip company Enfabrica Corp. (Mountain View, Calif.) has raised US$115 million as part of an oversubscribed Series C round of funding led by Spark Capital.New investors supporting Enfabrica include: Arm, Cisco Investments, Maverick Silicon, Samsung Catalyst Fund and VentureTech Alliance. Existing...

Published on: November 19, 2024

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