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PICMG releases CompactPCI Serial R3 specification

PICMG releases CompactPCI Serial R3 specification

PICMG has released the third revision of the CompactPCI Serial specification (CPCI-S.0 R3.0), which aims to ensure future viability and scalability for many years. CompactPCI Serial was originally developed as an extension of the open CompactPCI® standard to meet the demand for...

Published on: April 22, 2025

Open Architecture Quantum Computing Specification and Testbed

Open Architecture Quantum Computing Specification and Testbed

TreQ in the UK has secured a £1.65m grant to embark on an ambitious project aimed at advancing quantum computing technology. The focus of this endeavor is the development of an open architecture testbed known as the OAQ Testbed. This innovative platform...

Published on: April 22, 2025

“Bus Battery Health CheckUp Tool”

“Bus Battery Health CheckUp Tool”

Introducing a groundbreaking innovation in the world of electric buses - the CheckUp tool. Developed by the Dutch organization TNO, this special charger is designed to revolutionize the way we monitor and maintain bus batteries. The CheckUp tool operates on a unique...

Published on: April 22, 2025

Tariff prospects dampen notebook market recovery

Tariff prospects dampen notebook market recovery

The uncertainty generated by recent multiple US tariff announcements is starting to have an effect on a notebook computer market recovery, prompting market analyst TrendForce to reduce its forecast for market growth in 2025. Trendforce had seen strong shipments over the winter...

Published on: April 22, 2025

Cadence validates 12.8 Gbps DDR5 MRDIMM IP system

Cadence validates 12.8 Gbps DDR5 MRDIMM IP system

Cadence has introduced the first DDR5 12.8 Gbps MRDIMM Gen2 memory IP system on the TSMC N3 process, catering to the increasing demand for enhanced memory bandwidth to meet the requirements of AI processing in enterprise and data center applications, particularly in...

Published on: April 22, 2025

Renesas introduces low-power MCUs in RA0 series

Renesas introduces low-power MCUs in RA0 series

Renesas Electronics Corporation has recently unveiled a new group of low-power, cost-effective MCUs as part of the popular RA0 Series, known as the RA0E2. These MCUs are powered by the Arm® Cortex®-M23 processor and boast exceptional energy efficiency, an extended temperature range,...

Published on: April 22, 2025

Low cost Cortex-M23 microcontroller extends temperature range

Low cost Cortex-M23 microcontroller extends temperature range

Renesas Electronics has introduced a new family of microcontrollers based on the ARM Cortex-M23 core, offering low cost, low power consumption, and an extended temperature range. The RA0E2 range of 32MHz devices features up to 128KB integrated Code Flash memory and 16KB...

Published on: April 22, 2025

High voltage CMOS backplane for OLED microdisplays

High voltage CMOS backplane for OLED microdisplays

Researchers at Fraunhofer in Germany have made a significant breakthrough in the field of OLED microdisplays by developing a high voltage CMOS backplane that enhances the brightness of these displays. OLEDs have traditionally faced limitations in achieving very high brightness levels in...

Published on: April 22, 2025

Micron restructures for AI

Micron restructures for AI

Micron Technology, a leading US-based semiconductor company, is making strategic changes to its business units to take advantage of the increasing demand for high-performance memory solutions in the field of artificial intelligence (AI). The company is restructuring its operations to better cater...

Published on: April 22, 2025

Low power AI chip for robotics

Low power AI chip for robotics

Researchers in the United States have recently unveiled an innovative low-power multicore AI chip designed specifically for robotics applications. Known as the MAVERIC chip, this cutting-edge technology was developed at the University of California, Berkeley. The chip boasts a 16nm process and...

Published on: April 21, 2025

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