Infineon Technologies has introduced its inaugural P-channel power MOSFET specifically qualified for space applications. This new 60 V P-channel MOSFET is a valuable addition to the existing lineup of 60 V and 150 V N-channel devices, all of which are housed in...
UK processor startup VyperCore has unveiled the initial outcomes from its VyperLab evaluation platform. Through the utilization of the Python community’s PyPerformance unmodified benchmark code, the RTL of a custom RISC-V processor has demonstrated up to 5x performance enhancements on existing code...
Elektor and eeNews Europe are gearing up for the Embedded World exhibition in Nuremberg, Germany, with the release of a special bonus edition focusing on AI. This collaboration highlights the increasing importance of artificial intelligence in embedded systems, which serve as the...
Emerson has introduced a cutting-edge software test suite called NI LabVIEW+ Suite for HIL, tailored to meet the increasing demands of engineers involved in developing and testing embedded software. Specifically designed for hardware-in-the-loop (HIL) applications, this suite integrates test, validation, and data...
An innovative inference accelerator chip tailored for processing spiking neural networks (SNNs) has been created by the Fraunhofer Institute for Integrated Circuits IIS. Named SENNA, this chip is designed to facilitate the rapid processing of low-dimensional time series data in artificial intelligence...
Infineon Technologies is set to unveil a virtual prototype of a microcontroller based on the RISC-V open instruction set architecture specifically designed for automotive applications in the upcoming week. This new addition will join the Aurix family, which currently includes devices based...
This new camera design may initially confuse you, but the Escura InstantSnap offers a unique blend of digital technology with an all-analog look and feel. At first glance, it may resemble a magnifier lens or a vintage device, but it is, in...
EnSilica, a company based in the UK, has been tasked with the design and development of a crucial silicon component for the next-generation resilient multi-band Global Navigation Satellite System (“GNSS”) capabilities for the European Space Agency (ESA). This project falls under ESA’s...
Rohde & Schwarz and Ceva have joined forces to unveil the pioneering test platform that supports the upcoming Bluetooth® OTA UTP Test Mode, streamlining over-the-air (OTA) controlled device testing. Premiering at Embedded World 2025, the UTP test mode platform is built on...
Power Integrations has recently announced a significant advancement in its HiperLCS chipset, doubling the power output to provide up to 1650W of continuous power for power tools. The new HiperLCS-2 chipset features a half-bridge switch and enhanced package, boasting over 98 percent...
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