OKI in collaboration with Nisshinbo Micro Devices has successfully achieved 3D integration of thin-film analog ICs using Crystal Film Bonding (CFB) technology.CFB can be applied to heterogeneous integration, a technology that combines different semiconductor devices with different process nodes, functions (such as...
Sivers Semiconductors announced that it has signed a contract to develop high-performance, low-cost digitizers based on the NXP Layerscape platform for Intelsat’s SATCOM terminals.Sivers and NXP have been long-standing partners in the application of the Layerscape platform to 5G O-RAN applications. This...
Alongside its project Stargate activities, Softbank is working with UK/US firm Quantinuum on hybrid quantum computing systems in data centres.Combining CPUs, GPUs and Quantum Processing Units (QPUs) holds the potential to further extend the capabilities of AI, says Softbank. The combination means...
The SPECTRAN® V6 MOBILE, just launched by Aaronia, is a portable real-time spectrum analyzer series that enables precise and reliable measurements on site.The tablet spectrum analyzer is the first to use an in-house developed PC board with AMD Ryzen™ 7 Core 8845HS...
AMD is using a digital twin simulation platform from rFpro in the UK to accelerate the development of automated driving technologies.The AV elevate simulation platform launched last year will be used to tune and test automated parking systems on thousands of parking...
Forvia Hella in Germany is to use 1200V silicon carbide (SiC) MOSFETs from Infineon Technologies for its next generation 800 V DC-DC charging systems.The SIC MOSFETs come in a Q-DPAK package with top-side cooling (TSC) for thermal management in on-board charger and...
The emergence of Chinese AI company DeepSeek has some key lessons for the European industry say European AI entrepreneurs from Fractile and Graphcore to Axelera.DeepSeek, based in Hangzhou in south-east China, has developed two AI frameworks that can run large language models...
iPronics, a leading deep tech startup in software-defined photonic engines, has announced a 20M€ series A funding round that will accelerate the deployment of its Optical Networking Engine (ONE), in AI data centers, enabling fast, scalable and high-bandwidth communication for energy-efficient AI.Current...
Molex has announced the compact MMCX Power over Coax (PoC) connectors, which feature a patent-pending mating technique to ensure secure and stable connections while maintaining electrical ground continuity.PoC is ideally suited for space-constrained applications where reliable RF connections and continuous power delivery...
The UK government has invested £20m in rocket company Orbex to boost the chances of a successful launch.Orbex first announced its Series D round in April last year, and backing from the Export & Investment Fund of Denmark (EIFO), Octopus Ventures and...
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