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Electronic Breaking News

Innovative Room Temperature Thermal Generator Unveiled

Innovative Room Temperature Thermal Generator Unveiled

Researchers in Japan have made a groundbreaking discovery by developing a new type of organic thermoelectric device capable of harvesting energy from ambient temperature. The team at Kyushu University has successfully created a thermal generator that operates at room temperature without requiring...

Published on: September 27, 2024

VW’s AI Privacy Concerns: Vehicle Picture Capture Issue

VW’s AI Privacy Concerns: Vehicle Picture Capture Issue

The Volkswagen Group is embarking on a groundbreaking initiative to leverage sensor and image data from its vehicles in order to enhance the training of its Advanced Driver Assistance Systems (ADAS) safety features. This innovative approach aims to further improve the safety...

Published on: September 27, 2024

Siemens to Spin Out Charging Infrastructure Business

Siemens to Spin Out Charging Infrastructure Business

Siemens took a significant step in its eMobility journey by consolidating its charging activities in 2018 and recently establishing a dedicated business unit in 2022. This strategic move aimed to enhance the company's focus and agility in the rapidly evolving electric vehicle...

Published on: September 27, 2024

UK Chip ‘Scale Up’ Receives Full £11m Funding

UK Chip ‘Scale Up’ Receives Full £11m Funding

The UK government has recently unveiled plans to support 16 semiconductor projects with a total funding of £11.5 million. This initiative, backed by Innovate UK, aims to accelerate the development of semiconductor technologies within the country. While the individual project allocations are...

Published on: September 27, 2024

€3m European Project Aims for Sustainable Energy Harvesting

€3m European Project Aims for Sustainable Energy Harvesting

A groundbreaking €3.1 million European project is paving the way for a sustainable platform in energy harvesting. The SELECT (Sustainable Electronics for Energy Harvesting Applications) project has brought together key technology developers to create a complete battery-free platform tailored for IoT designs.The...

Published on: September 26, 2024

Ensilica Inks 10-Year Microwave Chip Deal in Italy

Ensilica Inks 10-Year Microwave Chip Deal in Italy

Ensilica, a UK-based company, has entered into a groundbreaking partnership with Siae Microelettronica in Italy to design custom microwave and RF telecoms chips. This strategic collaboration is part of a ten-year deal that will see Ensilica developing Application-Specific Integrated Circuits (ASICs) for...

Published on: September 26, 2024

Silvaco Enhances Digital Twin Tool for Cryo CMOS, FinFET, and GAA Technologies

Silvaco Enhances Digital Twin Tool for Cryo CMOS, FinFET, and GAA Technologies

Silvaco, a leading provider of simulation software for semiconductor devices, has recently announced the expansion of its TCAD digital twin tool to support the latest CMOS FinFET and GAA transistor technologies, as well as planar devices down to 1 Kelvin.The 2024 TCAD...

Published on: September 26, 2024

Greenerwave Introduces RIS Technology for FR1, FR2, and FR3 Bands

Greenerwave Introduces RIS Technology for FR1, FR2, and FR3 Bands

Greenerwave is at the forefront of innovation in the telecommunications industry by offering Reconfigurable Intelligent Surfaces (RIS) in FR1, FR2, and FR3 bands. This unique RIS offering is set to advance research in this future-oriented field and unlock new use cases in...

Published on: September 26, 2024

Bending the Rules with RISC-V

Bending the Rules with RISC-V

Nature journal has recently published an innovative research article by Pragmatic Semiconductor, unveiling a groundbreaking Bendable Non-silicon RISC-V Microprocessor. This cutting-edge technology represents a significant milestone as the world's first 32-bit microprocessor designed to be flexible while maintaining full functionality even when...

Published on: September 26, 2024

Ceva and Edge Impulse Collaborate for Rapid AI Development

Ceva and Edge Impulse Collaborate for Rapid AI Development

The collaboration between Ceva and NeuPro-Nano marks a significant milestone in the realm of embedded AI development. This unique partnership, centered around an NPU IP, empowers developers to benchmark and enhance the performance of their edge AI models within the Edge Impulse...

Published on: September 26, 2024

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