The research infrastructure in Switzerland has received a significant upgrade with the introduction of 'Alps,' a supercomputer powered by a Cray Supercomputer EX from Hewlett-Packard Enterprise (HPE) and equipped with 10,752 NVIDIA Grace Hopper superchips. This impressive setup places 'Alps' among the...
Published on: September 19, 2024
Protean Electric, a pioneering company in electric vehicle technology, is spearheading a £5.5m (€6.5m) project aimed at developing a production line for in-wheel motors (IWM). The project, named PULSE (Power electronics Upscale for Localisation and Sustainable Electrification), is a collaborative effort with...
Published on: September 19, 2024
The US Commerce Department’s Bureau of Industry and Security (BIS) has recently announced global controls on the shipment of quantum, 2nm semiconductor, and 3D printing technologies. This move comes as part of the US interim final rule (IFR) that aims to regulate...
Published on: September 09, 2024
Oxford PV, a leading solar technology company, has achieved a significant milestone by shipping the world's first commercial perovskite tandem solar panels. The company's inaugural shipment consists of 72 cell tandem perovskite solar panels destined for a US customer for a utility-scale...
Published on: September 08, 2024
Kochpatcharin recently spoke at the Semicon Taiwan 2024 Forum, where it was revealed that Samsung and TSMC have joined forces on memory technology for the first time. This collaboration marks a significant milestone in the industry, bringing together two major players to...
Published on: September 08, 2024
After years of setbacks and bureaucratic hurdles, Tower Semiconductor is once again making headlines with its ambitious plans to establish a wafer fab in India. The company's proposal, in collaboration with Adani Group, aims to set up a state-of-the-art manufacturing facility in...
Published on: September 08, 2024
The prestigious 2024 Millennium Technology Prize has been awarded to Professor Bantval Jayant Baliga of North Carolina State University for his groundbreaking invention of the Insulated Gate Bipolar Transistor (IBGT). This technology, developed in the 1980s, has played a crucial role in...
Published on: September 07, 2024
An alliance of companies is aiming to boost the use of glass substrates for more complex AI chips and chiplets.The E-Core Alliance, led by E&R Engineering in Taiwan, has brought together over 15 companies to accelerate the development of large glass substrates....
Published on: September 06, 2024
Shin-Etsu Chemical, a leading company in Japan, has recently unveiled a groundbreaking 300mm (12in) substrate designed specifically for GaN epitaxial growth. This innovative product has already entered the market in the form of samples, marking a significant advancement in the field of...
Published on: September 06, 2024
Eggtronic, a company based in Italy, has recently unveiled an innovative evaluation board (EVB) tailored for smaller 240W power delivery (PD) 3.1 applications that require fast charging capabilities.The SmartEgg 240W PD 3.1 EVB charger design, developed by Eggtronic, boasts a peak efficiency...
Published on: September 06, 2024