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IGBT Inventor Awarded $1M Prize

IGBT Inventor Awarded $1M Prize

The prestigious 2024 Millennium Technology Prize has been awarded to Professor Bantval Jayant Baliga of North Carolina State University for his groundbreaking invention of the Insulated Gate Bipolar Transistor (IBGT). This technology, developed in the 1980s, has played a crucial role in...

Published on: September 07, 2024

AI Chiplets Boosted by Glass Substrate Alliance

AI Chiplets Boosted by Glass Substrate Alliance

An alliance of companies is aiming to boost the use of glass substrates for more complex AI chips and chiplets.The E-Core Alliance, led by E&R Engineering in Taiwan, has brought together over 15 companies to accelerate the development of large glass substrates....

Published on: September 06, 2024

Advancements in GaN Technology: 300mm Wafer Breakthrough

Advancements in GaN Technology: 300mm Wafer Breakthrough

Shin-Etsu Chemical, a leading company in Japan, has recently unveiled a groundbreaking 300mm (12in) substrate designed specifically for GaN epitaxial growth. This innovative product has already entered the market in the form of samples, marking a significant advancement in the field of...

Published on: September 06, 2024

240W Charger Evaluation Board with Single-Stage PFC

240W Charger Evaluation Board with Single-Stage PFC

Eggtronic, a company based in Italy, has recently unveiled an innovative evaluation board (EVB) tailored for smaller 240W power delivery (PD) 3.1 applications that require fast charging capabilities.The SmartEgg 240W PD 3.1 EVB charger design, developed by Eggtronic, boasts a peak efficiency...

Published on: September 06, 2024

Theion Launches Solid State Sulfur Battery Center

Theion Launches Solid State Sulfur Battery Center

German battery company theion has recently inaugurated a cutting-edge Technology Centre in Berlin, signaling the commencement of customer evaluation for its innovative sulfur battery cells. Situated in the science and technology park in Adlershof, the theion centre is dedicated to the development...

Published on: September 06, 2024

Stellantis-Foxconn Venture Utilizes Siemens Tools

Stellantis-Foxconn Venture Utilizes Siemens Tools

SiliconAuto, a joint venture of European car maker Stellantis and contract manufacturer Hon Hai Technology (Foxconn), has recently announced its adoption of the PAVE360 software from Siemens Digital Industries Software. This strategic move is aimed at reducing development time for the automotive...

Published on: September 06, 2024

Nokia and CommScope Collaborate on AI-Powered Wi-Fi and Fiber Connectivity

Nokia and CommScope Collaborate on AI-Powered Wi-Fi and Fiber Connectivity

The collaboration between RUCKUS Networks and Nokia brings forth an innovative integrated fiber and Wi-Fi solution tailored to enhance end-user connectivity experiences in various settings such as multi-dwelling units (MDUs), hospitality, large public venues (LPVs), and educational institutions. This cutting-edge offering combines...

Published on: September 06, 2024

LG Partners with Blue Cheetah for AI Chiplet Design

LG Partners with Blue Cheetah for AI Chiplet Design

Blue Cheetah Analog Design in the US and LG Electronics have joined forces to develop a cutting-edge generation of chiplets. This collaboration has already seen LG tape out silicon using the Blue Cheetah chiplet interconnect, paving the way for future AI-enabled products....

Published on: September 05, 2024

Volvo Partners with Blackwell GPU for Software-Defined Cars

Volvo Partners with Blackwell GPU for Software-Defined Cars

Volvo Cars made a significant leap forward this week by introducing its first software-defined vehicle, powered by the cutting-edge Orin processor from Nvidia. The company also revealed plans to incorporate the Blackwell GPU architecture into its future models. This move marks a...

Published on: September 05, 2024

ROHM and UAES Collaborate on SiC Power Devices

ROHM and UAES Collaborate on SiC Power Devices

ROHM and United Automotive Electronic Systems (UAES) have been working closely together, engaging in detailed technical exchanges focused on automotive applications utilizing silicon carbide (SiC) power devices. This collaboration reached a new milestone in 2020 with the establishment of the SiC Joint...

Published on: September 05, 2024

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