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Electronic Breaking News

Survey shows decline in first-time-right IC design

Survey shows decline in first-time-right IC design

A recent global survey of 597 design verification engineers and executives has revealed a concerning trend - a significant decrease in first-time-right IC designs in 2024. The data shows that only 14 percent of IC designs are proven correct on the initial...

Published on: April 29, 2025

Is ARM really 40?

Is ARM really 40?

Over the years, landing on a specific date for technology launches has proven to be a challenge for many companies, including the UK processor core designer ARM. The journey of ARM began with the tape out of the first ARM processor, the...

Published on: April 29, 2025

Octric Semiconductor seeks new CEO

Octric Semiconductor seeks new CEO

When the UK government made the surprising move to acquire a semiconductor fab in Durham, one of the primary questions that arose was who would be at the helm of this new venture. The answer to that question is now on the...

Published on: April 28, 2025

Breakthrough Metasurface for Power-Free RF Filtering

Breakthrough Metasurface for Power-Free RF Filtering

Researchers at the Nagoya Institute of Technology in Japan have made a significant breakthrough in wireless communication technology with the development of a passive metasurface that can effectively combat multipath signal interference. This innovative metasurface does not require a powered filter to...

Published on: April 28, 2025

CGD unveils 800V EV power design

CGD unveils 800V EV power design

Cambridge GaN Devices (CGD) has collaborated with IFP Energies nouvelles (IFPEN) in France to develop a cutting-edge three-level power inverter for electric vehicles utilizing its integrated gallium nitride power device. This innovative project will be showcased at the upcoming PCIM power exhibition...

Published on: April 28, 2025

“Filtronic Introduces mmWave Feeder Links for Viasat D2D Project”

“Filtronic Introduces mmWave Feeder Links for Viasat D2D Project”

Filtronic has entered into a collaboration with the European Space Agency (ESA) and Viasat as part of the Direct-to-Device (D2D) initiative. The company is contributing advanced feeder link technology to facilitate seamless connectivity between Earth and an open-architecture LEO network. This partnership...

Published on: April 28, 2025

Sondrel is now Aion Silicon

Sondrel is now Aion Silicon

UK chip design house Sondrel has re-branded as Aion Silicon as it joins the Intel Foundry alliance. Aion provides design services and chip production services down to the 3nm leading edge process at foundries such as TSMC and Samsung with over 100...

Published on: April 28, 2025

TSMC unveils integrated voltage regulator for AI

TSMC unveils integrated voltage regulator for AI

TSMC has unveiled an innovative Integrated Voltage Regulator (IVR) tailored for AI applications, boasting an impressive five times the vertical power density delivery compared to a traditional discrete design. This breakthrough comes at a crucial time as the latest AI datacentre chips...

Published on: April 27, 2025

Thin film pyroelectric enhances thermal sensors

Thin film pyroelectric enhances thermal sensors

Researchers at the Massachusetts Institute of Technology (MIT) have made a significant breakthrough in the field of thermal sensing technology by developing a technique to create ultra-thin pyroelectric films that can operate at room temperature. This innovation opens up new possibilities for...

Published on: April 27, 2025

Fujitsu Riken unveil 256qubit quantum computer

Fujitsu Riken unveil 256qubit quantum computer

Riken, the renowned research center in Japan, has achieved a significant milestone in the field of quantum computing by successfully scaling up its 64-qubit superconducting quantum computer to a powerful 256-qubit machine, all within the same compact footprint. This remarkable advancement is...

Published on: April 27, 2025

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