Suitable for extreme environments, the heat pipe cooling technology developed by Cognatec and launched at Embedded World 2025 employs acetone as the working fluid instead of water. Acetone prevents the thermal transfer medium from freezing at extreme sub-zero temperatures, preventing damage to...
Published on: March 13, 2025
Three bidders from different regions are reportedly in contention for a recent semiconductor-related acquisition, according to industry sources. Among them, two are from Asia, while one represents European interests. One notable contender is Silex Microsystems AB, a Sweden-based company under Chinese ownership....
Published on: March 13, 2025
OpenLight Photonics, a leading photonic chip designer, has recently unveiled a groundbreaking 400G/lane modulator on the integrated silicon photonics platform at Tower Semiconductor. The impressive achievement was made possible through the utilization of the PH18DA process, enabling the design to surpass a...
Published on: March 13, 2025
Infineon Technologies has introduced a cutting-edge 48 V wide input voltage range digital hot swap controller, the XDP711-001, specifically designed for high-power AI servers. This innovative controller features a programmable safe operating area (SOA) control, providing enhanced safety and efficiency in server...
Published on: March 13, 2025
The US National Institute of Standards and Technology (NIST) has selected a new algorithm for post-quantum encryption. The HQC algorithm is designed to act as a backup for ML-KEM, the primary algorithm for general encryption with key encapsulation. HQC utilizes a different...
Published on: March 13, 2025
German board maker congatec has unveiled a new heatpipe cooling system designed for Computer-on-Module (COMs) at Embedded World in Nuremberg. This innovative system utilizes acetone as a working fluid in the heat pipes, offering several advantages over traditional water-based systems. By using...
Published on: March 13, 2025
Infineon Technologies is making strides in the tech industry by developing the industry’s first 12kW battery backup unit (BBU) specifically designed for AI data centres. This innovative solution comes in response to the increasing power demands of the next generation of AI...
Published on: March 12, 2025
OPmobility in France has made a significant move by adopting Teamcenter X, the cloud-enabled Product Lifecycle Management (PLM) software from Siemens, for its automotive systems. Formerly known as Plastic Omnium, OPmobility aims to leverage Teamcenter as its central platform to streamline workflows,...
Published on: March 12, 2025
The automotive software development landscape is evolving rapidly, with a recent survey highlighting key trends in the industry. According to the 2025 State of Automotive Software Development Report from Perforce, there is a noticeable shift towards prioritizing safety in conjunction with the...
Published on: March 12, 2025
QuamCore in Israel has emerged from stealth with €9m funding for a new type of digital logic for building quantum computers with 1m qubits. Rather than using CMOS, QuamCom is using superconducting flux loops to provide digital logic with a new architecture...
Published on: March 12, 2025