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Lam Research agrees to invest US$1.2 billion in India

Lam Research agrees to invest US$1.2 billion in India

Semiconductor manufacturing equipment maker Lam Research has said it plans to spend US$1.2 billion setting up facilities in Bengalaru, India, over the next few years, according to reports.Multiple reports say that Lam Research said at an ‘Invest Karnataka’ event that it has...

Published on: February 14, 2025

A SysML roadmap for European car makers

A SysML roadmap for European car makers

The German automotive industry has developed a prototype roadmap of open source tools and technologies to speed up vehicle development.The €16m, six year GENIAL project brought together key players in the ecosystem to develop concepts and methods to help car makers and...

Published on: February 14, 2025

ARM signs Meta as first chip product customer, says report

ARM signs Meta as first chip product customer, says report

ARM has signed Meta Platforms Inc., formerly Facebook, as its first customer for a chip product as it transitions from being only a licensor of chip IP, according to the Financial Times.The chip, a server CPU for data centers, will be customizable...

Published on: February 14, 2025

EnCharge AI raises $100m from Samsung, Foxconn

EnCharge AI raises $100m from Samsung, Foxconn

Analog in-memory compute startup EnCharge AI has raised $100m from some key industry investors to bring its accelerator chip and boards to market this year.The oversubscribed Series B round, led by Tiger Global, brings the total raised to $144m. New investors in...

Published on: February 14, 2025

World’s largest FPGA boosts Synopsys prototyping, emulation systems

World’s largest FPGA boosts Synopsys prototyping, emulation systems

Synopsys has used the world’s largest FPGA, the AMD Versal Premium VP1902 adaptive SoC, to double the capacity and speed of its prototyping and emulation systems.The HAPS-200 prototyping system can run chip designs with up to 10.8bn gates at the RTL level...

Published on: February 14, 2025

Trump set to delay, cut CHIPS Act payments

Trump set to delay, cut CHIPS Act payments

President Trump’s White House is looking to renegotiate US CHIPS and Science Act awards, according to a Reuters report.Where and how large the cuts will be is not yet clear but Trump is reported to be frustrated with companies that have agreed...

Published on: February 14, 2025

Startup seed funding for low-power chips for phased array antennas

Startup seed funding for low-power chips for phased array antennas

To develop low-power microchips for the next generation of phased array antennas, Oso Semiconductor has raised an oversubscribed $5.2 million seed round, led by Engine Ventures with Entrada Ventures, Berkeley SkyDeck and J-Ventures also participating.The funds will be used to build pre-production...

Published on: February 14, 2025

Kulr, Worksport team on battery, BMS technologies

Kulr, Worksport team on battery, BMS technologies

Kulr and Worksport have signed a strategic deal on battery pack development using thermal protection materials as well as AI-integrated battery management system (BMS) software design.The deal also covers manufacturing of the Worksport power packs in the US with the Kulr thermal...

Published on: February 14, 2025

IP royalty boost for Ceva

IP royalty boost for Ceva

Ceva has seen its revenues increase 10% to $106.9m as part of its recovery to a pure IP company. This was reflected in the royalty revenue of $46.9 million, up 18% year-over-year“2024 was a pivotal year for Ceva. We successfully concluded long-term licensing...

Published on: February 14, 2025

Infineon ships first SiC devices from 200mm wafers

Infineon ships first SiC devices from 200mm wafers

Infineon Technologies has shipped its first silicon carbide (SiC) power devices built on larger 200mm wafers.Almost all SiC devices are built on 150mm wafers, and there are significant challenges in using the larger wafers. Shipping devices from 200mm is a key step...

Published on: February 14, 2025

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