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Electronic Breaking News

US Allocates $1.6bn for Advanced Chiplet Packaging R&D

US Allocates $1.6bn for Advanced Chiplet Packaging R&D

The National Institute of Standards and Technology (NIST) has unveiled an exciting opportunity for the microelectronics industry with the launch of a competition for $1.6 billion in funding. This funding is specifically earmarked for the establishment of four advanced packaging research and...

Published on: July 10, 2024

SoundHound Integrates ChatGPT into European Cars

SoundHound Integrates ChatGPT into European Cars

The automotive industry is witnessing a groundbreaking development as the SoundHound Chat AI voice assistant, integrated with ChatGPT, goes live in Peugeot, Opel, and Vauxhall vehicles across 11 European markets. These markets include Austria, France, Germany, Italy, Spain, and the United Kingdom,...

Published on: July 10, 2024

Cutting-Edge High-Frequency Switch for 6G Networks

Cutting-Edge High-Frequency Switch for 6G Networks

The landscape of communication technology is on the brink of a significant transformation with the emergence of 6G mass communication systems. A recent study published in Nature Electronics has shed light on a groundbreaking development that promises to revolutionize the way we...

Published on: July 10, 2024

STM Incorporates Ceva Cellular IP in NB-IoT Industrial Module

STM Incorporates Ceva Cellular IP in NB-IoT Industrial Module

Narrowband IoT (NB-IoT) has emerged as a revolutionary cellular communication technology tailored for low-power, wide-area (LPWA) connectivity. This innovative technology facilitates efficient data transmission for a diverse range of IoT devices and services, catering to the evolving needs of the digital era.The...

Published on: July 10, 2024

AMD Acquires Europe’s Largest AI Lab for $665m

AMD Acquires Europe’s Largest AI Lab for $665m

AMD has announced its plans to acquire Silo.ai, Europe’s largest private AI lab, in a $665 million cash deal. This move is aimed at accelerating the development and deployment of AMD-powered AI models and software. The acquisition of Silo.ai in Helsinki, Finland,...

Published on: July 10, 2024

KD Launches Optical Interconnect Lab in Spain

KD Launches Optical Interconnect Lab in Spain

KD, formerly known as KDPOF, has recently undergone a rebranding as it inaugurates a cutting-edge prototyping laboratory and assembly and test facility in Tres Cantos, Madrid, Spain.The establishment of the optical interconnect lab, situated in close proximity to the company's headquarters and...

Published on: July 10, 2024

UK Launches V2G Fleet Charging Trial

UK Launches V2G Fleet Charging Trial

The United Kingdom is at the forefront of innovation once again, as it invites companies to participate in a groundbreaking trial of next-generation AC vehicle-to-grid (V2G) electric vehicle (EV) fleet charging technology. This initiative, known as the V2VNY project, aims to revolutionize...

Published on: July 10, 2024

Analog-Digital Fusion Power Supply Control

Analog-Digital Fusion Power Supply Control

Analog controlled power supplies have long been a staple in industrial robotics and semiconductor manufacturing equipment operating in the medium power range. However, the demand for higher reliability and precise control has posed challenges for traditional analog-only configurations. On the other hand,...

Published on: July 10, 2024

Cutting-Edge High Inrush Power Relays for Smart Lighting and IoT

Cutting-Edge High Inrush Power Relays for Smart Lighting and IoT

Providing an up-to-20A of latching relay functionality, the DW-YL series is specifically designed for demanding applications with high inrush currents. The power relays can handle up to 320 A for 1.2ms, making them ideal for capacitive loads and other scenarios where robust...

Published on: July 10, 2024

Cutting-Edge Global Shutter Sensor for AR/VR/MR

Cutting-Edge Global Shutter Sensor for AR/VR/MR

For the first time ever, Omnivision is bringing its patented DCG™ high dynamic range (HDR) technology to the AR/VR/MR market in the 2.2-micron (µm) pixel OG0TC GS image sensor.With a package size of just 1.64- x 1.64-mm, the OG0TC is an ultra-small...

Published on: July 10, 2024

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