https://www.nuvation.com/

Electronic Breaking News

NGK Teams Up for Hybrid Ceramic Module Substrates

NGK Teams Up for Hybrid Ceramic Module Substrates

A groundbreaking startup based in Taiwan is making waves in the tech industry with its innovative approach to developing ceramic substrates integrated with rechargeable lithium-ion batteries for optoelectronic and RF modules. PanelSemi, the company behind this cutting-edge technology, is at the forefront...

Published on: July 02, 2024

Ilika Ships Prototype Silicon Battery Cell to Car Maker

Ilika Ships Prototype Silicon Battery Cell to Car Maker

UK-based battery developer Ilika has reached a significant milestone by shipping its first batch of prototype solid-state battery pouch cells to a tier 1 automotive company for testing. This development marks a crucial step forward in Ilika's journey towards revolutionizing battery technology.Ilika...

Published on: July 02, 2024

Nvidia Faces Charges Under French Competition Law

Nvidia Faces Charges Under French Competition Law

The tech giant Nvidia is currently facing a wave of antitrust scrutiny in multiple countries, including the European Union, the United States, and China. The investigation began following a raid on Nvidia's premises in Paris by the French antitrust regulator, the Autorité...

Published on: July 02, 2024

Breakthrough: First 1.6T PAM4 DSP Revolutionizes Active Electrical Cables

Breakthrough: First 1.6T PAM4 DSP Revolutionizes Active Electrical Cables

Artificial intelligence (AI) and machine learning (ML) applications are pushing the boundaries of connectivity bandwidth requirements within data center racks. The latest addition to the Alaska A family, built on a 5nm process, utilizes Marvell PAM4 DSP technology to facilitate short-reach copper...

Published on: July 02, 2024

Rogue Valley Secures CHIPS Funding for 300mm MEMS Fab

Rogue Valley Secures CHIPS Funding for 300mm MEMS Fab

Rogue Valley Microdevices (RVM) has recently made significant strides in expanding its operations by signing a non-binding preliminary memorandum of terms with the US Department of Commerce. This agreement supports the construction of RVM's second wafer fab, located in Palm Bay, Florida....

Published on: July 02, 2024

Nvidia Faces Charges Under French Competition Laws

Nvidia Faces Charges Under French Competition Laws

The tech giant Nvidia is currently facing a wave of antitrust scrutiny in multiple countries, with regulators honing in on potential anti-competitive practices. The investigation was triggered by a raid conducted by the French antitrust regulator, the Autorité de la concurrence, at...

Published on: July 02, 2024

Startup Vaire Set to Release First Reversible Computing Chip Within a Year

Startup Vaire Set to Release First Reversible Computing Chip Within a Year

The company's self-declared mission is to use reversible computing to create near zero-energy chips for generative AI and always-on edge devices.The seed round funders include Tom Knight, founder of Ginkgo Bioworks and the inventor of modern reversible computing, Vaire said in a...

Published on: July 02, 2024

New Cost-Effective Silicon-Based Photodiodes for Near-IR Applications

New Cost-Effective Silicon-Based Photodiodes for Near-IR Applications

In a groundbreaking project at the Fraunhofer Institute for Photonic Microsystems IPMS, a new era of sensitive silicon-based photodiodes is being ushered in for near-infrared (near-IR) applications. While silicon is the default material for photodiodes in the visible range due to its...

Published on: July 02, 2024

GF Acquires GaN Power IP from Tagore Tech

GF Acquires GaN Power IP from Tagore Tech

GlobalFoundries has recently made a significant acquisition, obtaining an intellectual property portfolio of power GaN technology and key staff members from Tagore Technology in the United States. This strategic move, made for an undisclosed sum, is set to bolster GF's position in...

Published on: July 02, 2024

Enhanced Ethernet with COTS Conduction-Cooled XMC Module

Enhanced Ethernet with COTS Conduction-Cooled XMC Module

The TXMC397 series represents a cutting-edge addition to TEWS Technologies' product lineup, catering to the needs of various demanding applications with its high-speed Ethernet connectivity. Consisting of two variants, the TXMC397-10R and TXMC397-20R, this module offers exceptional performance and flexibility. The former...

Published on: July 02, 2024

Find Design Services

Get IC Prices

Get Price Offers From
Welcome New Vendors
Browse Vendor Directories
Featured Vendor

Intigia

Recent Posts
Most Popular Blog Posts
HardwareBee

Copyright 2017-2024, HardwareBee. All rights reserved.

Follow Us

Be sure to follow our LinkedIn company page where we share our latest updates LinkedIn
Partner with us Partner with us

Design and Manufacturing Services