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CEA-Leti Unveils €830m FAMES Pilot Line Project

CEA-Leti Unveils €830m FAMES Pilot Line Project

CEA-Leti, a leading research institute in France, has recently initiated an €830 million pilot line dedicated to advancing next-generation process technologies. Known as the FAMES Pilot Line, this ambitious project aims to develop and implement five innovative sets of technologies, ranging from...

Published on: June 24, 2024

New Low Power MCU Portfolio with Wi-Fi 6/6E and Bluetooth Integration

New Low Power MCU Portfolio with Wi-Fi 6/6E and Bluetooth Integration

The latest offering from Infineon Technologies, the flexible MCU platform, is set to revolutionize the IoT industry by accelerating customers’ time-to-market with a range of cutting-edge features. This platform comes equipped with ModusToolbox ™ software, RTOS and Linux host drivers, a fully...

Published on: June 24, 2024

Rohde & Schwarz Joins AI-RAN Alliance for 5G/6G Advancement

Rohde & Schwarz Joins AI-RAN Alliance for 5G/6G Advancement

The renowned technology company Rohde & Schwarz has reached a significant milestone on its journey towards 6G by becoming a member of the AI-RAN Alliance. This move signifies a deepening of the company's collaboration with industry leaders in the development of AI-native...

Published on: June 24, 2024

Innoscience Seeks USPTO Ruling on Infineon GaN Patent

Innoscience Seeks USPTO Ruling on Infineon GaN Patent

Infineon's US Patent No. 9,899,481 lies at the center of legal disputes initiated by Infineon against Innoscience in both the United States and Europe. Innoscience Technology Co. Ltd., based in Zhuhai, China, has raised concerns regarding the validity of the patent in...

Published on: June 24, 2024

Enhanced Speech Recognition for Augmented Reality

Enhanced Speech Recognition for Augmented Reality

Augmented reality (AR) technology is rapidly advancing, offering a wide array of possibilities to enhance everyday experiences. At the forefront of this innovation is the potential for AR to revolutionize communication through speech recognition models. Researchers have been exploring the use of...

Published on: June 24, 2024

Tenstorrent Partners with Baya Systems for AI/RISC-V Chiplet Technology

Tenstorrent Partners with Baya Systems for AI/RISC-V Chiplet Technology

Baya Systems and Tenstorrent have joined forces to revolutionize the world of chiplet technology. Baya’s IP and software flow have empowered Tenstorrent and its partners to analyze, customize, and deploy its intelligent compute platform for current and future workloads. This collaboration aims...

Published on: June 24, 2024

Silicon Box Chooses Novara for Italian Chiplet Fab Site

Silicon Box Chooses Novara for Italian Chiplet Fab Site

If Novara is confirmed as the location for Silicon Box's new chiplet factory, it would be situated near a 300mm wafer plant constructed by MEMC Electronic Materials SpA, the Italian subsidiary of GlobalWafers Co. Ltd. of Taiwan, which recently received a €100...

Published on: June 24, 2024

dSPACE Teams Up with AWS for Natural Language AI Testing

dSPACE Teams Up with AWS for Natural Language AI Testing

The automotive industry is on the brink of a major breakthrough in autonomous vehicle testing thanks to the collaboration between dSPACE and the AWS Generative AI Innovation Center. This partnership has led to the development of a cutting-edge scenario generation feature that...

Published on: June 24, 2024

Chip Manufacturing Capacity Expansion to Persist

Chip Manufacturing Capacity Expansion to Persist

Leading-edge capacity, defined as being for 5nm nodes and under, is expected to grow 13 percent in 2024, chiefly driven by generative artificial intelligence (AI) for data center training, inference, and leading-edge devices. Intel, Samsung, and TSMC are poised to start production...

Published on: June 24, 2024

Revolutionary Holographic Windscreen Unveiled

Revolutionary Holographic Windscreen Unveiled

Ceres Holographics, based in Scotland, has achieved a groundbreaking milestone in the automotive industry by introducing the world's first fully integrated windscreen featuring multiple holographic optical elements (HOEs) within a single laminate.The innovative holographic windscreen, developed in collaboration with Eastman in the...

Published on: June 24, 2024

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