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Echion Secures £29m for Niobium Battery Technology

Echion Secures £29m for Niobium Battery Technology

Echion Technologies, a UK-based company, has recently announced a successful fundraising round amounting to £29 million (€35 million, $37 million) to support the development of its innovative niobium-based fast-charging battery material.This significant funding injection will allow Echion to ramp up the production...

Published on: June 14, 2024

Fraunhofer and EV Collaborate on 300mm 3D Quantum Chip

Fraunhofer and EV Collaborate on 300mm 3D Quantum Chip

The EV Group (EVG) has announced a new collaboration with the Fraunhofer IZM-ASSID All Silicon System Integration division to focus on the development and optimization of alternative bonding and debonding technologies for 300mm CMOS and heterogeneous integration applications, including quantum computing.Fraunhofer IZM-ASSID...

Published on: June 14, 2024

Electrovaya Unveils Advanced Solid State Battery Technology

Electrovaya Unveils Advanced Solid State Battery Technology

Canadian battery maker Electrovaya is at the forefront of developing innovative solid state battery technology specifically designed for heavy duty electric vehicles. The company's commitment to sustainability and efficiency has led to significant advancements in the field of lithium ion conducting ceramics.Electrovaya's...

Published on: June 14, 2024

Soitec and UMC Collaborate on Groundbreaking 3D RF-SOI Chips

Soitec and UMC Collaborate on Groundbreaking 3D RF-SOI Chips

French substrate developer Soitec has joined forces with UMC to pioneer the industry's groundbreaking 3D IC solution tailored for Radio Frequency Silicon-on-Insulator (RF-SOI) technology, specifically designed for 5G and millimeter wave applications.UMC's innovative 3D IC technology for RF-SOI leverages Soitec's engineered wafers...

Published on: June 13, 2024

New Crowdfunding Campaign for Electric 19-Seater Aircraft

New Crowdfunding Campaign for Electric 19-Seater Aircraft

French electric aircraft developer Aura Aero is currently in the process of raising funds for its innovative 19-seater aircraft through a crowdfunding campaign. The company is aiming to secure €500,000, which represents 0.2% of its €266 million valuation, to support the detailed...

Published on: June 13, 2024

Alphawave Semi Tapes Out Cutting-Edge 7nm Multi-Protocol I/O Chiplet

Alphawave Semi Tapes Out Cutting-Edge 7nm Multi-Protocol I/O Chiplet

Alphawave Semi has achieved a significant milestone by taping out the industry’s first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC’s advanced 7nm process. This innovative chiplet integrates Alphawave IP with cutting-edge technologies such as 800G Ethernet, PCI Express 6.0, CXL 3.x, and...

Published on: June 13, 2024

140 GHz Multi-Antenna Transceiver Achieves Sub-THz Breakthrough

140 GHz Multi-Antenna Transceiver Achieves Sub-THz Breakthrough

Devices supporting mmWave frequencies, antenna systems, and RF transceiver modules for future mobile communications standards or automotive radar applications will share the same characteristics that make them challenging to test. The wide frequency range, greater number of antenna elements, and lack of...

Published on: June 13, 2024

AdaCore Joins Safety-Critical Rust Consortium

AdaCore Joins Safety-Critical Rust Consortium

AdaCore, a leading provider of software development and verification tools, has announced a groundbreaking collaboration with industry giants to establish the Safety-Critical Rust Consortium. The consortium will focus on advancing the use of the Rust programming language in safety-critical systems, with the...

Published on: June 13, 2024

Samsung Introduces 2nm and 4nm Process Nodes Alongside AI Platform

Samsung Introduces 2nm and 4nm Process Nodes Alongside AI Platform

Empowering AI with state-of-the-art process technologyUnder the theme “Empowering the AI Revolution,” Samsung announced its reinforced process technology roadmap, including two new cutting-edge nodes — SF2Z and SF4U — as well as its integrated Samsung AI Solutions platform harnessing the unique strengths...

Published on: June 13, 2024

Infineon Achieves Milestone with Kulim 200mm SiC Fab Phase 1 Completion

Infineon Achieves Milestone with Kulim 200mm SiC Fab Phase 1 Completion

Infineon Technologies has reached a significant milestone by completing the first phase of its 200mm Silicon Carbide (SiC) power fab in Kulim, Malaysia. This achievement marks a crucial step forward in the company's strategic plans for expanding its production capabilities.With the official...

Published on: June 13, 2024

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