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Electronic Breaking News

Pegatron Certifies ZutaCore’s Direct-to-Chip Liquid Cooling Technology

Pegatron Certifies ZutaCore’s Direct-to-Chip Liquid Cooling Technology

AI server manufacturer Pegatron has recently announced the certification of the cutting-edge HyperCool direct-to-chip two-phase liquid cooling technology developed by ZutaCore. This innovative technology is capable of efficiently cooling up to 2,800 watts of power, offering a simple deployment process with minimal...

Published on: June 05, 2024

NXP and Vanguard to Construct $8B Analog Wafer Fab in Singapore

NXP and Vanguard to Construct $8B Analog Wafer Fab in Singapore

VisionPower Semiconductor Manufacturing Company Pte. Ltd. is set to make a significant impact in the semiconductor industry as it announces plans to operate as a foundry specializing in the production of 130nm to 40nm mixed-signal, power management, and analog products. The company...

Published on: June 05, 2024

NXP and Vanguard Partner with TSMC for VSMC 300mm Legacy Fab

NXP and Vanguard Partner with TSMC for VSMC 300mm Legacy Fab

NXP Semiconductor and Vanguard International Semiconductor (VIS) have announced a strategic partnership to utilize TSMC process technology for a joint venture 300mm fab named VisionPower Semiconductor Manufacturing Company (VSMC). This collaboration aims to enhance the production of power management and mixed signal...

Published on: June 05, 2024

Tech Startup Secures £3.4m Funding for RF MEMS in Satellite and 5G/6G Tech

Tech Startup Secures £3.4m Funding for RF MEMS in Satellite and 5G/6G Tech

Sofant Technologies, a pioneering company, has unveiled a groundbreaking radio platform that promises to revolutionize the landscape of wireless communication systems. This innovative platform is designed to slash power consumption in future wireless systems by an impressive 70%. The company's primary focus...

Published on: June 05, 2024

Isolation Transformer with 8mm Clearance

Isolation Transformer with 8mm Clearance

Bourns, a leading manufacturer of electronic components, has recently introduced its second-generation AECQ-200 High Clearance/Creepage Distance Isolation Power Transformer series.The AEC-Q200 compliant HCT8xxxxEAL is a push-pull high voltage isolation transformer with reinforced insulation designed to handle working voltages up to 800 V...

Published on: June 05, 2024

Tailored RISC-V Core for Efficient Applications

Tailored RISC-V Core for Efficient Applications

Codasip, based in Munich, has recently unveiled a new RISC-V core that promises significant enhancements in performance and efficiency. The L110 low power embedded processor core boasts up to 50% improvements in performance per watt and a 20% reduction in code size....

Published on: June 05, 2024

AI Smart Ring Empowered by Ambiq Chiplet

AI Smart Ring Empowered by Ambiq Chiplet

Ambiq has joined forces with Bravechip Technology in China to develop an innovative AI chiplet tailored for smart ring designs. This collaboration aims to enhance the functionality and efficiency of smart rings through cutting-edge technology.The Bravechip Artificial Intelligence of Things (AIoT) System...

Published on: June 05, 2024

Vector and QNX Collaborate on Software Defined Vehicles

Vector and QNX Collaborate on Software Defined Vehicles

Vector has partnered with operating system supplier QNX to facilitate the transition to Automotive Safety Integrity Level (ASIL) D for Software-Defined Vehicles (SDV). This collaboration aims to provide OEMs and Tier-1s with the necessary integration, interface, and safety case to develop AUTOSAR-based...

Published on: June 05, 2024

Rapidus Broadens IBM Partnership to Include Chiplet Packaging

Rapidus Broadens IBM Partnership to Include Chiplet Packaging

Rapidus, a leading semiconductor company, has recently announced an expansion of its partnership with IBM to include chiplet packaging for the 2nm devices it plans to manufacture in Japan. This collaboration marks a significant step forward in the development of cutting-edge semiconductor...

Published on: June 05, 2024

Aixtron Chooses Turin for Chip Equipment Factory

Aixtron Chooses Turin for Chip Equipment Factory

The renowned company Aixtron, specializing in metalo-organic chemical vapor deposition (MOCVD) equipment, has announced its strategic move to establish a new production facility in Italy. This decision comes in response to the projected increase in European demand for their equipment, particularly for...

Published on: June 04, 2024

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