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Electronic Breaking News

Quantum Leap: Alice and Bob Achieve 10x Qubit Stability Increase

Quantum Leap: Alice and Bob Achieve 10x Qubit Stability Increase

French quantum qubit developer Alice and Bob have made significant advancements in extending the stability of qubits for quantum computers. Their latest research has shown a remarkable increase in the resilience of qubits, particularly in reducing quantum errors.The Cat qubit design developed...

Published on: May 23, 2024

Nvidia’s Sales Quadruple Year-on-Year

Nvidia’s Sales Quadruple Year-on-Year

The latest financial report from Nvidia has stunned investors and analysts alike, with the company announcing a net profit of US$14.88 billion, representing a remarkable 57 percent of sales. As a result of this outstanding performance, Nvidia has decided to increase its...

Published on: May 23, 2024

Rubber Structures with Smart Computing Abilities

Rubber Structures with Smart Computing Abilities

In the realm of electronics, digital bits are the fundamental building blocks used for intricate calculations, typically processed through complex circuits comprising numerous elements. However, a group of innovative researchers has recently introduced a groundbreaking alternative approach to computation. They have harnessed...

Published on: May 23, 2024

I2C Bridge Tag Enhances IoT Device Security with NFC Authentication

I2C Bridge Tag Enhances IoT Device Security with NFC Authentication

Infineon Technologies has introduced a new NFC I2C bridge tag designed for single-tap authentication and secure configuration of Internet of Things (IoT) devices. The Infineon Optiga Authenticate NBT stands out as the sole asymmetric cryptography tag in the market certified as a...

Published on: May 23, 2024

ESA Partners with European Company for Space Capsule Project

ESA Partners with European Company for Space Capsule Project

The European Space Agency (ESA) has taken a significant step forward in its space exploration endeavors by commissioning its first Cargo Return Service from a European supplier. The Exploration Company (TEC), based in Planegg, Bavaria, has been tasked with building a reusable...

Published on: May 23, 2024

CSPs Optimistic: AI to Boost Network Efficiency

CSPs Optimistic: AI to Boost Network Efficiency

Network benefitsThe integration of artificial intelligence (AI) into network operations is poised to revolutionize the efficiency and capabilities of the telecommunications and IT industry. A recent study conducted by Ciena in collaboration with Censuswide revealed that over half of surveyed engineers anticipate...

Published on: May 23, 2024

X-FAB and Soitec Collaborate on SiC Wafers

X-FAB and Soitec Collaborate on SiC Wafers

Collaboration between Soitec and X-FAB is set to revolutionize the manufacturing of SiC power devices, following the successful completion of the assessment phase. During this phase, SiC power devices were manufactured at X-FAB Texas on 150mm SmartSiC™ wafers. Soitec will now offer...

Published on: May 23, 2024

Advanced PXI Microwave Multiplexer with High Channel Count

Advanced PXI Microwave Multiplexer with High Channel Count

The 40/42-788 family of microwave switches is a cutting-edge series of products based on Radiall mechanical microwave switches known for their superior quality. These switches offer a wide range of bandwidth options, spanning from 8 GHz to 40 GHz. With versatile switching...

Published on: May 22, 2024

Boosting Radiant Intensity with Small AEC-Q102 Qualified IR Emitters

Boosting Radiant Intensity with Small AEC-Q102 Qualified IR Emitters

Built on Vishay's Astral surface emitter chip technology, the latest IR emitters are making waves in the automotive industry. These cutting-edge emitters are designed to handle high drive currents of up to 1.5 A DC and 5 A pulsed, setting a new...

Published on: May 22, 2024

Solderless Stackable Multi-Row Board-to-Board Connectors

Solderless Stackable Multi-Row Board-to-Board Connectors

The connectors offered by ENNOVI provide a unique and cost-effective approach to accommodating different pin count requirements using the same basic interconnect platform. This innovative solution eliminates the need for additional expenses or engineering efforts, making it a highly efficient choice for...

Published on: May 22, 2024

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